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F49L004UA-90N 参数 Datasheet PDF下载

F49L004UA-90N图片预览
型号: F49L004UA-90N
PDF下载: 下载PDF文件 查看货源
内容描述: 4兆位( 512K ×8 )只有3V CMOS闪存 [4 Mbit (512K x 8) 3V Only CMOS Flash Memory]
分类和应用: 闪存存储
文件页数/大小: 46 页 / 354 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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EFST  
preliminary  
F49L004UA / F49L004BA  
Reset Mode :  
Hardware Reset (for 40-TSOP package)  
valid addresses on the device address inputs produce  
valid data on the device data outputs. The device remains  
enabled for read access until the command register  
contents are altered.  
When the  
pin is driven low for at least a period  
RESET  
of tRP, the device immediately terminates any operation  
in progress, tri-states all output pins, and ignores all  
read/write commands for the duration of the  
RESET  
See “Read Command” section for more information. Refer  
to the AC Read Operations table for timing specifications  
and to Figure 5 for the timing diagram. I
CC1
in the DC  
Characteristics table represents the active current  
specification for reading array data.  
pulse. The device also resets the internal state machine  
to reading array data. The operation that was  
interrupted should be reinitiated later once the device is  
ready to accept another command sequence, to ensure  
the data integrity.  
The current is reduced for the duration of the  
RESET  
Write Mode  
pulse. When  
is held at VSS±0.3V, the device  
RESET  
draws CMOS standby current (ICC4). If  
is held  
To write a command or command sequence (which  
includes programming data to the device and erasing  
RESET  
at VIL but not within VSS±0.3V, the standby current will be  
greater.  
sectors of memory), the system must drive  
and  
CE  
WE  
to VIL, and  
to VIH. The “Program Command” section  
OE  
has details on programming data to the device using  
standard command sequences.  
The  
pin may be tied to system reset circuitry. A  
RESET  
system reset would thus reset the Flash memory,  
enabling the system to read the boot-up firm-ware from  
the Flash memory.  
An erase operation can erase one sector, multiple  
sectors, or the entire device. Tables 1 and 2 indicate the  
address space that each sector occupies. A “sector  
address” consists of the address bits required to uniquely  
select a sector. The “Software Command Definitions”  
section has details on erasing a sector or the entire chip,  
or suspending/resuming the erase operation.  
If  
is asserted during a program or erase  
RESET  
embedded algorithm operation, the RY/  
pin remains  
BY  
a "0" (busy) until the internal reset operation is  
complete, which requires a time of tREADY (during  
Embedded Algorithms). The system can thus monitor  
When the system writes the auto-select command  
sequence, the device enters the auto-select mode. The  
system can then read auto-select codes from the internal  
register (which is separate from the memory array) on  
DQ7–DQ0. Standard read cycle timings apply in this  
mode. Refer to the Auto-select Mode and Auto-select  
Command sections for more information. ICC2 in the DC  
Characteristics table represents the active current  
specification for the write mode. The “AC Characteristics”  
section contains timing specification tables and timing  
diagrams for write operations.  
RY/  
to determine whether the reset operation is  
BY  
complete.  
If  
is asserted when a program or erase  
RESET  
operation is not executing , i.e. the RY/  
is “1”, the  
BY  
reset operation is completed within a time of tREADY (not  
during Embedded Algorithms). The system can read  
data after tRH when the  
pin returns to VIH. Refer  
RESET  
to the AC Characteristics tables for Hardware Reset  
section.  
Automatic Sleep Mode  
Read Mode  
The automatic sleep mode minimizes Flash device energy  
consumption. The device automatically enables this mode  
when addresses remain unchanged for over 250ns ns.  
To read array data from the outputs, the system must  
drive the  
and  
pins to VIL.  
is the power  
CE  
OE  
CE  
The automatic sleep mode is independent of the  
,
CE  
control signals. Standard address access  
timings provide new data when addresses are changed.  
While in sleep mode, output data is latched and always  
available to the system. ICC4 in the DC Characteristics  
table represents the automatic sleep mode current  
specification.  
control and selects the device.  
is the output control  
OE  
, and  
WE  
OE  
and gates array data to the output pins.  
should  
WE  
remain at VIH. The internal state machine is set for  
reading array data upon device power-up, or after a  
hardware reset. This ensures that no spurious alteration  
of the memory content occurs during the power  
transition.  
No command is necessary in this mode to obtain array  
data. Standard microprocessor’s read cycles that assert  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2  
7/46