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EM44CM0884LBA-3I 参数 Datasheet PDF下载

EM44CM0884LBA-3I图片预览
型号: EM44CM0884LBA-3I
PDF下载: 下载PDF文件 查看货源
内容描述: [Programmable CAS Latency]
分类和应用:
文件页数/大小: 28 页 / 778 K
品牌: EOREX [ EOREX CORPORATION ]
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EM44CM0884LBA  
512Mb (16M×4Bank×8) Double DATA RATE 2 SDRAM  
Features  
Description  
The EM44CM0884LBA is a high speed Double Date  
JEDEC Standard VDD/VDDQ = 1.8V±0.1V.  
All inputs and outputs are compatible with SSTL_18  
interface.  
Rate 2 (DDR2) Synchronous DRAM fabricated with  
high performance CMOS process containing  
Fully differential clock inputs (CK, /CK) operation.  
Eight Banks  
536,870,912 bits which organized as 16Mbits x 4  
banks by 8 bits. This synchronous device achieves  
high speed double-data-rate transfer rates of up to  
800 MT/sec (DDR2-800) for general applications.  
The chip is designed to comply with the following key  
DDR2 SDRAM features: (1) posted CAS with  
additive latency, (2) write latency = read latency -1,  
(3) Off-Chip Driver (OCD) impedance adjustment and  
On Die Termination (4) normal and weak strength  
data output driver. All of the control and address  
inputs are synchronized with a pair of externally  
supplied differential clocks. Inputs are latched at the  
cross point of differential clocks (CK rising and /CK  
falling). All I/Os are synchronized with a pair of  
bidirectional strobes (DQS and /DQS) in a source  
synchronous fashion. The address bus is used to  
convey row, column and bank address information in  
a /RAS and /CAS multiplexing style. The 512Mb  
DDR2 devices operates with a single power supply:  
1.8V ± 0.1V VDD and VDDQ. Available package:  
FBGA-60Ball (with 0.8mm x 0.8mm ball pitch)  
Posted CAS  
Bust length: 4 and 8.  
Programmable CAS Latency (CL): 5, 6, 7  
• Programmable Additive Latency (AL): 0, 1, 2, 3, 4,  
5 & 6.  
• Write Latency (WL) =Read Latency (RL) -1.  
• Read Data Strobe (RDQS) supported  
• Bi-directional Differential Data Strobe (DQS).  
• Data inputs on DQS centers when write.  
• Data outputs on DQS, /DQS edges when read.  
• On chip DLL align DQ, DQS and /DQS transition  
with CK transition.  
• DM mask write data-in at the both rising and falling  
edges of the data strobe.  
• Sequential & Interleaved Burst type available.  
Off-Chip Driver (OCD) Impedance Adjustment  
• On Die Termination (ODT)  
• Auto Refresh and Self Refresh  
• 8,192 Refresh Cycles / 64ms  
7.8us at average periodic refresh interval  
• RoHS Compliance  
tRAS lockout supported  
• High Temperature Self-Refresh rate enable  
Dec. 2014  
2/28  
www.eorex.com