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EBJ21UE8BFU0-GN-F 参数 Datasheet PDF下载

EBJ21UE8BFU0-GN-F图片预览
型号: EBJ21UE8BFU0-GN-F
PDF下载: 下载PDF文件 查看货源
内容描述: 2GB DDR3 SDRAM SO- DIMM [2GB DDR3 SDRAM SO-DIMM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 16 页 / 247 K
品牌: ELPIDA [ ELPIDA MEMORY ]
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EBJ21UE8BFU0  
Serial PD Matrix  
-DJ  
-GN  
-GL  
Byte No. Function described  
Hex Comments  
Hex Comments  
Hex Comments  
Number of serial PD bytes written/  
0
92h 176/256/0-116  
92h 176/256/0-116  
92h 176/256/0-116  
SPD device size/CRC coverage  
SPD revision  
1
2
3
4
10h Rev.1.0  
10h Rev.1.0  
10h Rev.1.0  
Key byte/DRAM device type  
Key byte/module type  
0Bh DDR3 SDRAM  
03h SO-DIMM  
0Bh DDR3 SDRAM  
03h SO-DIMM  
0Bh DDR3 SDRAM  
03h SO-DIMM  
SDRAM density and banks  
02h 1G bits, 8 banks  
02h 1G bits, 8 banks  
02h 1G bits, 8 banks  
14 rows,  
10 columns  
14 rows,  
10 columns  
14 rows,  
10 columns  
5
SDRAM addressing  
11h  
11h  
11h  
6
7
8
Module nominal voltage, VDD  
Module organization  
00h 1.5V  
00h 1.5V  
00h 1.5V  
09h 2 ranks/×8 bits  
03h 64 bits/non-ECC  
09h 2 ranks/×8 bits  
03h 64 bits/non-ECC  
09h 2 ranks/×8 bits  
03h 64 bits/non-ECC  
Module memory bus width  
Fine timebase (FTB)  
dividend/divisor  
9
52h 5/2  
52h 5/2  
52h 5/2  
10  
11  
Medium timebase (MTB) dividend  
01h  
08h  
1
8
01h  
08h  
1
8
01h  
08h  
1
8
Medium timebase (MTB) divisor  
SDRAM minimum cycle time  
(tCK (min.))  
Reserved  
12  
0Ch 1.5ns  
00h  
0Ah 1.25ns  
00h  
FEh 5, 6, 7, 8, 9, 10, 11 FEh 5, 6, 7, 8, 9, 10, 11  
00h 00h  
0Ah 1.25ns  
13  
14  
00h  
SDRAM CAS latencies supported, LSB7Eh 5, 6, 7, 8, 9, 10  
SDRAM CAS latencies supported,  
MSB  
SDRAM minimum CAS latencies  
time (tAA (min.))  
SDRAM minimum write recovery  
time (tWR (min.))  
SDRAM minimum /RAS to /CAS  
delay (tRCD (min.))  
SDRAM minimum row active to row  
active delay (tRRD (min.))  
SDRAM minimum row precharge  
time (tRP (min.))  
SDRAM upper nibbles for tRAS and  
tRC  
SDRAM minimum active to  
precharge time (tRAS (min.)), LSB  
SDRAM minimum active to active  
/auto-refresh time (tRC (min.)), LSB  
SDRAM minimum refresh recovery  
time delay (tRFC (min.)), LSB  
SDRAM minimum refresh recovery  
time delay (tRFC (min.)), MSB  
SDRAM minimum internal write to  
read command delay (tWTR (min.))  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
00h  
69h 13.125ns  
78h 15ns  
69h 13.125ns  
78h 15ns  
64h 12.5ns  
78h 15ns  
64h 12.5ns  
30h 6ns  
69h 13.125ns  
30h 6ns  
69h 13.125ns  
30h 6ns  
69h 13.125ns  
69h 13.125ns  
64h 12.5ns  
11h  
11h  
11h —  
20h 36ns  
18h 35ns  
18h 35ns  
7Ch 47.5ns  
70h 110ns  
03h 110ns  
3Ch 7.5ns  
89h 49.125ns  
70h 110ns  
03h 110ns  
3Ch 7.5ns  
81h 48.125ns  
70h 110ns  
03h 110ns  
3Ch 7.5ns  
SDRAM minimum internal read to  
precharge command delay  
(tRTP (min.))  
27  
3Ch 7.5ns  
3Ch 7.5ns  
3Ch 7.5ns  
28  
29  
30  
31  
Upper nibble for tFAW  
Minimum four activate window delay  
time (tFAW (min.))  
00h 30ns  
F0h 30ns  
00h 30ns  
00h 30ns  
F0h 30ns  
F0h 30ns  
SDRAM optional features  
83h DLL-off, RZQ/6, 7  
PASR/2X refresh at  
83h DLL-off, RZQ/6, 7  
83h DLL-off, RZQ/6, 7  
PASR/2X refresh at  
+85ºC to +95ºC  
PASR/2X refresh at  
+85ºC to +95ºC  
SDRAM thermal and refresh options 81h  
81h  
81h  
+85ºC to +95ºC  
Data Sheet E1642E30 (Ver. 3.0)  
5