EBJ11RD8BAFA
Ordering Information
Component
Data rate
Mbps (max.)
JEDEC speed bin*1
(CL-tRCD-tRP)
Contact
pad
Part number
Package
Mounted devices
240-pin DIMM
(lead-free)
EBJ11RD8BAFA-DG-E 1333
EBJ11RD8BAFA-DJ-E
DDR3-1333G (8-8-8)
DDR3-1333H (9-9-9)
Gold
EDJ5308BASE-DG-E
EDJ5308BASE-DG-E
EDJ5308BASE-DJ-E
EDJ5308BASE-DG-E
EDJ5308BASE-DJ-E
EDJ5308BASE-AC-E
EDJ5308BASE-AE-E
EBJ11RD8BAFA-AE-E 1066
EBJ11RD8BAFA-AG-E
DDR3-1066F (7-7-7)
DDR3-1066G (8-8-8)
DDR3-800D (5-5-5)
EDJ5308BASE-DG-E
EDJ5308BASE-DJ-E
EDJ5308BASE-AC-E
EDJ5308BASE-AE-E
EDJ5308BASE-AG-E
EDJ5308BASE-DG-E
EDJ5308BASE-DJ-E
EDJ5308BASE-AC-E
EDJ5308BASE-8A-E
EBJ11RD8BAFA-8A-E 800
EDJ5308BASE-DG-E
EDJ5308BASE-DJ-E
EDJ5308BASE-AC-E
EDJ5308BASE-AE-E
EDJ5308BASE-AG-E
EDJ5308BASE-8A-E
EDJ5308BASE-8C-E
EBJ11RD8BAFA-8C-E
DDR3-800E (6-6-6)
Note: 1. Module /CAS latency = component CL + 1.
Preliminary Data Sheet E1189E20 (Ver. 2.0)
2
ELPIDA [ ELPIDA MEMORY ]
