Spec. No. : C179SP
Issued Date : 2017.08.23
Revised Date :
CYStech Electronics Corp.
Page No. : 6/6
TO-277 Dimension
Marking:
DISP
0165CT
Date
Code
□□
3-Lead TO-277 Plastic
Surface Mounted Package
CYStek Package Code: SP
Style: Pin 1.Cathode 2.Anode 3.Cathode
Millimeters
Inches
Min.
Millimeters
Inches
Min.
DIM
DIM
Min.
1.05
0.80
1.70
0.15
0.20
4.00
3.90
Max.
1.15
0.99
1.88
0.35
0.33
4.30
4.05
Max.
0.045
0.039
0.074
0.014
0.013
0.169
0.159
Min.
Max.
3.15
6.60
5.45
3.65
4.60
Max.
0.124
0.260
0.215
0.144
0.181
A
b1
b2
b3
C
0.041
0.031
0.067
0.006
0.008
0.157
0.154
D2
E
E1
E2
E3
e
2.95
6.40
5.30
3.45
4.20
0.116
0.252
0.209
0.136
0.165
D
D1
1.84 TYP
0.072 TYP
L
0.75
0.95
0.030
0.037
Notes: 1.Controlling dimension : millimeters.
2.Lead thickness specified per L/F drawing with solder plating.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DISP0165CTSP
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
