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DISP0165CTSP-0-T6-G 参数 Datasheet PDF下载

DISP0165CTSP-0-T6-G图片预览
型号: DISP0165CTSP-0-T6-G
PDF下载: 下载PDF文件 查看货源
内容描述: [Switching Control Diode]
分类和应用:
文件页数/大小: 6 页 / 606 K
品牌: CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
 浏览型号DISP0165CTSP-0-T6-G的Datasheet PDF文件第1页浏览型号DISP0165CTSP-0-T6-G的Datasheet PDF文件第2页浏览型号DISP0165CTSP-0-T6-G的Datasheet PDF文件第3页浏览型号DISP0165CTSP-0-T6-G的Datasheet PDF文件第4页浏览型号DISP0165CTSP-0-T6-G的Datasheet PDF文件第6页  
Spec. No. : C179SP  
Issued Date : 2017.08.23  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 5/6  
Recommended wave soldering condition  
Product  
Peak Temperature  
Soldering Time  
5 +1/-1 seconds  
Pb-free devices  
260 +0/-5 °C  
Recommended temperature profile for IR reflow  
Profile feature  
Average ramp-up rate  
(Tsmax to Tp)  
Sn-Pb eutectic Assembly  
Pb-free Assembly  
3°C/second max.  
3°C/second max.  
Preheat  
Temperature Min(TS min)  
Temperature Max(TS max)  
Time(ts min to ts max)  
100°C  
150°C  
60-120 seconds  
150°C  
200°C  
60-180 seconds  
Time maintained above:  
Temperature (TL)  
Time (tL)  
183°C  
60-150 seconds  
240 +0/-5 °C  
217°C  
60-150 seconds  
260 +0/-5 °C  
Peak Temperature(TP)  
Time within 5°C of actual peak  
temperature(tp)  
10-30 seconds  
20-40 seconds  
Ramp down rate  
Time 25 °C to peak temperature  
6°C/second max.  
6°C/second max.  
6 minutes max.  
8 minutes max.  
Note :1. All temperatures refer to topside of the package, measured on the package body surface.  
2. For devices mounted on FR-4 PCB of 1.6mm or equivalent grade PCB. If other grade PCB is used, care  
should be taken to match the coefficients of thermal expansion between components and PCB. If they are  
not matched well, the solder joints may crack or the bodies of the parts may crack or shatter as the assembly  
cools.  
DISP0165CTSP  
CYStek Product Specification  
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