Spec. No. : C822FP
Issued Date : 2005.07.29
Revised Date :
CYStech Electronics Corp.
Page No. : 5/ 5
TO-220FP Dimension
Marking:
D2012
Style: Pin 1.Base 2.Collector 3.Emitter
4.Collector
3-Lead TO-220FP Plastic Package
CYStek Package Code: FP
*: Typical
Inches
DIM
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
Min.
0.392
0.583
Max.
Min.
Max.
0.408
0.598
10.360
A
A1
A2
A3
b
0.169
0.185
4.300
4.700
D
E
9.960
0.051 REF
1.300 REF
14.800 15.200
2.540 TYP
0.110
0.098
0.020
0.043
0.059
0.020
0.126
0.114
0.030
0.053
0.069
0.030
2.800
2.500
0.500
1.100
1.500
0.500
3.200
2.900
0.750
1.350
1.750
0.750
e
0.100 TYP
F
0.106 REF
0.138 REF
2.700 REF
Φ
L
3.500 REF
b1
b2
c
1.102
1.118
0.075
0.083
28.000 28.400
L1
L2
0.067
0.075
1.700
1.900
1.900
2.100
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTD2012FP
CYStek Product Specification