Spec. No. : C811T3
Issued Date : 2017.01.18
Revised Date :
CYStech Electronics Corp.
Page No. : 5/5
TO-126 Dimension
Marking:
B857
□□□□
Date Code
1
2
3
3-Lead TO-126 Plastic Package
CYStek Package Code: T3
Style: Pin 1.Emitter 2.Collector 3.Base
*: Typical
Inches
Min. Max.
*0.090
Millimeters
Inches
Millimeters
Min. Max.
*2.290
4.480
0.000
15.300
2.100
3.900
3.000
DIM
DIM
Min.
Max.
2.900
1.500
0.860
1.370
0.600
7.800
11.000
Min.
Max.
0.114
0.059
0.034
0.054
0.024
0.307
0.433
A
A1
b
b1
c
2.500
1.100
0.660
1.170
0.450
7.400
10.600
0.098
0.043
0.026
0.046
0.018
0.291
0.417
e
e1
h
L
L1
P
4.680
0.300
15.700
2.300
4.100
3.200
0.176
0.000
0.602
0.083
0.154
0.118
0.184
0.012
0.618
0.091
0.161
0.126
D
E
Φ
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB857T3
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
