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BCM43340HKUBG 参数 Datasheet PDF下载

BCM43340HKUBG图片预览
型号: BCM43340HKUBG
PDF下载: 下载PDF文件 查看货源
内容描述: [Single-Chip, Dual-Band (2.4 GHz/5 GHz) IEEE 802.11 a/b/g/n MAC/Baseband/Radio with Integrated Bluetooth 4.0]
分类和应用:
文件页数/大小: 96 页 / 1349 K
品牌: CYPRESS [ CYPRESS ]
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PRELIMINARY  
CYW43340  
Contents  
1. Introduction ...................................................................4  
1.1 Overview ...............................................................4  
1.2 Features ................................................................5  
1.3 Standards Compliance ..........................................6  
2. Power Supplies and Power Management ...................7  
2.1 Power Supply Topology ........................................7  
2.2 WLAN Power Management ...................................9  
2.3 PMU Sequencing ..................................................9  
2.4 Power-Off Shutdown ...........................................10  
2.5 Power-Up/Power-Down/Reset Circuits ...............10  
3. Frequency References ...............................................11  
3.1 Crystal Interface and Clock Generation ..............11  
3.2 TCXO ..................................................................11  
3.3 Frequency Selection ............................................13  
3.4 External 32.768 kHz Low-Power Oscillator .........14  
4. Bluetooth Subsystem Overview ................................15  
4.1 Features ..............................................................15  
4.2 Bluetooth Radio ...................................................16  
5. Bluetooth Baseband Core .........................................17  
5.1 Bluetooth 4.0 Features ........................................17  
5.2 Link Control Layer ...............................................17  
5.3 Test Mode Support ..............................................17  
5.4 Bluetooth Power Management Unit .....................18  
5.5 Adaptive Frequency Hopping ..............................21  
5.6 Advanced Bluetooth/WLAN Coexistence ............21  
5.7 Fast Connection (Interlaced Page  
and Inquiry Scans) ..............................................21  
6. Microprocessor and Memory Unit for Bluetooth .....22  
6.1 RAM, ROM, and Patch Memory ..........................22  
6.2 Reset ...................................................................22  
7. Bluetooth Peripheral Transport Unit ........................23  
7.1 PCM Interface .....................................................23  
7.2 UART Interface ....................................................30  
7.3 I2S Interface ........................................................31  
8. WLAN Global Functions ............................................34  
8.1 WLAN CPU and Memory Subsystem ..................34  
8.2 One-Time Programmable Memory ......................34  
8.3 GPIO Interface ....................................................34  
8.4 External Coexistence Interface ...........................34  
8.5 UART Interface ....................................................35  
8.6 JTAG Interface ....................................................35  
9. WLAN Host Interfaces ................................................36  
9.1 SDIO v2.0 ............................................................36  
9.2 HSIC Interface .....................................................38  
10. Wireless LAN MAC and PHY ...................................39  
10.1 MAC Features ...................................................39  
10.2 WLAN PHY Description .....................................42  
11. WLAN Radio Subsystem ..........................................44  
11.1 Receiver Path ....................................................44  
11.2 Transmit Path ....................................................44  
11.3 Calibration .........................................................44  
12. Pinout and Signal Descriptions ..............................45  
12.1 Signal Assignments ...........................................45  
12.2 Signal Descriptions ............................................45  
12.3 I/O States ..........................................................54  
13. DC Characteristics ...................................................57  
13.1 Absolute Maximum Ratings ...............................57  
13.2 Environmental Ratings ......................................57  
13.3 Electrostatic Discharge Specifications ..............58  
13.4 Recommended Operating Conditions  
and DC Characteristics .......................................58  
14. Bluetooth RF Specifications ....................................60  
15. WLAN RF Specifications ..........................................67  
15.1 Introduction ........................................................67  
15.2 2.4 GHz Band General RF Specifications .........68  
15.3 WLAN 2.4 GHz Receiver  
Performance Specifications ................................68  
15.4 WLAN 2.4 GHz Transmitter  
Performance Specifications ................................72  
15.5 WLAN 5 GHz Receiver  
Performance Specifications ................................73  
15.6 WLAN 5 GHz Transmitter  
Performance Specifications ................................75  
15.7 General Spurious Emissions Specifications ......76  
16. Internal Regulator Electrical Specifications ..........77  
16.1 Core Buck Switching Regulator .........................77  
16.2 3.3V LDO (LDO3P3) .........................................78  
16.3 2.5V LDO (LDO2P5) .........................................79  
16.4 HSICDVDD LDO ...............................................79  
16.5 CLDO ................................................................80  
16.6 LNLDO ..............................................................81  
17. System Power Consumption ...................................82  
17.1 WLAN Current Consumption .............................82  
17.2 Bluetooth, and BLE Current Consumption ........83  
18. Interface Timing and AC Characteristics ...............84  
18.1 SDIO Timing ......................................................84  
18.2 HSIC Interface Specifications ............................86  
18.3 JTAG Timing .....................................................86  
19. Power-Up Sequence and Timing .............................87  
19.1 Sequencing of Reset and  
Regulator Control Signals ...................................87  
20. Package Information ................................................90  
20.1 Package Thermal Characteristics .....................90  
20.2 Junction Temperature Estimation  
and PSIJT Versus THETAJC ...............................90  
20.3 Environmental Characteristics ...........................90  
21. Mechanical Information ...........................................91  
22. Ordering Information ................................................93  
Document History ...........................................................94  
Sales, Solutions, and Legal Information ......................96  
Document Number: 002-14943 Rev. *L  
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