CYW20704
Contents
4.3 EEPROM ............................................................13
4.4 External Reset ....................................................13
4.5 One-Time Programmable Memory .....................14
1. Overview............................................................ 4
1.1 Overview ............................................................. 4
1.2 Major Features .................................................... 4
1.3 Block Diagram ..................................................... 5
1.2 Usage Model ....................................................... 6
5. Peripheral Transport Unit.............................. 15
5.1 PCM Interface ....................................................15
5.2 HCI Transport Detection Configuration ..............16
5.3 USB Interface .....................................................17
5.4 UART Interface ..................................................18
5.5 Simultaneous UART Transport and Bridging .....18
2. Integrated Radio Transceiver.......................... 7
2.1 Transmit .............................................................. 7
2.2 Receiver .............................................................. 7
2.3 Local Oscillator Generation ................................. 7
2.4 Calibration ........................................................... 7
2.5 Internal LDO ........................................................ 8
6. Frequency References................................... 19
6.1 Crystal Interface and Clock Generation .............20
6.2 Crystal Oscillator ................................................20
6.3 Frequency Selection ..........................................20
6.4 Frequency Trimming ..........................................20
3. Bluetooth Baseband Core ............................... 9
3.1 Bluetooth Low Energy ......................................... 9
3.2 Bluetooth 4.1 Features ........................................ 9
3.3 Bluetooth 4.0 Features ........................................ 9
3.4 Link Control Layer ............................................. 10
3.5 Test Mode Support ............................................ 10
3.6 Power Management Unit ................................... 10
3.7 Adaptive Frequency Hopping ............................ 11
3.8 Collaborative Coexistence ................................ 12
3.9 Global Coexistence Interface ............................ 12
7. Pin-out and Signal Descriptions................... 21
7.1 Pin Descriptions .................................................21
8. Ball Grid Arrays.............................................. 23
9. Electrical Characteristics .............................. 24
9.1 RF Specifications ...............................................27
9.2 Timing and AC Characteristics ...........................31
9.3 I2S Interface .......................................................39
3.10 Recommended BT Coexistence Interface
Assignments ...................................................... 12
10. Mechanical Information ................................. 45
4. Microprocessor Unit....................................... 13
4.1 Overview ........................................................... 13
4.2 NVRAM Configuration Data and Storage .......... 13
10.1 Tape, Reel, and Packing Specification ..............46
11. Ordering Information ..................................... 47
Document History........................................................... 48
Document Number: 002-14786 Rev. *E
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