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AM29F400BB-70EI 参数 Datasheet PDF下载

AM29F400BB-70EI图片预览
型号: AM29F400BB-70EI
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash, 256KX16, 70ns, PDSO48, MO-142BDD, TSOP-48]
分类和应用: 光电二极管内存集成电路
文件页数/大小: 43 页 / 860 K
品牌: CYPRESS [ CYPRESS ]
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D A T A S H E E T  
GENERAL DESCRIPTION  
The Am29F400B is a 4 Mbit, 5.0 volt-only Flash  
memory organized as 524,288 bytes or 262,144 words.  
The device is offered in 44-pin SO and 48-pin TSOP  
packages. The device is also available in Known Good  
Die (KGD) form. For more information, refer to publica-  
tion number 21258. The word-wide data (x16) appears  
on DQ15–DQ0; the byte-wide (x8) data appears on  
DQ7–DQ0. This device is designed to be programmed in-  
Device erasure occurs by executing the erase  
command sequence. This initiates the Embedded  
Erase algorithm—an internal algorithm that automatically  
preprograms the array (if it is not already programmed)  
before executing the erase operation. During erase, the  
device automatically times the erase pulse widths and  
verifies proper cell margin.  
The host system can detect whether a program or  
erase operation is complete by observing the RY/BY#  
pin, or by reading the DQ7 (Data# Polling) and DQ6/  
DQ2 (toggle) status bits. After a program or erase  
cycle has been completed, the device is ready to read  
array data or accept another command.  
system with the standard system 5.0 volt V supply. A 12.0  
CC  
V V is not required for write or erase operations. The  
PP  
device can also be programmed in standard EPROM  
programmers.  
This device is manufactured using AMD’s 0.32 µm  
process technology, and offers all the features and ben-  
efits of the Am29F400, which was manufactured using  
0.5 µm process technology.  
The sector erase architecture allows memory sectors  
to be erased and reprogrammed without affecting the  
data contents of other sectors. The device is fully  
erased when shipped from the factory.  
The standard device offers access times of 45, 50, 55,  
70 and 90 ns, allowing high speed microprocessors to  
operate without wait states. To eliminate bus contention  
the device has separate chip enable (CE#), write  
enable (WE#) and output enable (OE#) controls.  
Hardware data protection measures include a low  
V
detector that automatically inhibits write opera-  
CC  
tions during power transitions. The hardware sector  
protection feature disables both program and erase  
operations in any combination of the sectors of memory.  
This can be achieved via programming equipment.  
The device requires only a single 5.0 volt power  
supply for both read and write functions. Internally  
generated and regulated voltages are provided for the  
program and erase operations.  
The Erase Suspend feature enables the user to put  
erase on hold for any period of time to read data from,  
or program data to, any sector that is not selected for  
erasure. True background erase can thus be achieved.  
The device is entirely command set compatible with the  
JEDEC single-power-supply Flash standard. Com-  
mands are written to the command register using  
standard microprocessor write timings. Register con-  
tents serve as input to an internal state-machine that  
controls the erase and programming circuitry. Write  
cycles also internally latch addresses and data needed  
for the programming and erase operations. Reading  
data out of the device is similar to reading from other  
Flash or EPROM devices.  
The hardware RESET# pin terminates any operation  
in progress and resets the internal state machine to  
reading array data. The RESET# pin may be tied to the  
system reset circuitry. A system reset would thus also  
reset the device, enabling the system microprocessor  
to read the boot-up firmware from the Flash memory.  
The system can place the device into the standby  
mode. Power consumption is greatly reduced in this mode.  
Device programming occurs by executing the program  
command sequence. This initiates the Embedded  
Program algorithm—an internal algorithm that auto-  
matically times the program pulse widths and verifies  
proper cell margin.  
AMD’s Flash technology combines years of Flash  
memory manufacturing experience to produce the  
highest levels of quality, reliability and cost effective-  
ness. The device electrically erases all bits within a sector  
simultaneously via Fowler-Nordheim tunneling. The data is  
programmed using hot electron injection.  
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Am29F400B  
21505E8 November 11, 2009