Typical Performance
25
90
80
70
60
50
40
30
20
10
0
Conditions:
TJ ≤ 150 °C
Conditions:
TJ ≤ 150 °C
20
15
10
5
0
-55
-30
-5
20
45
70
95
120
145
-55
-30
-5
20
45
70
95
120
145
Case Temperature, TC (°C)
Case Temperature, TC (°C)
Figure 19. Continuous Drain Current Derating vs.
Case Temperature
Figure 20. Maximum Power Dissipation Derating vs.
Case Temperature
11
10 µs
00..55
00..33
Limited by RDS On
100 µs
10.00
1 ms
100 ms
00..11
1.00
0.10
0.01
00..0055
110000EE--33
00..0022
Conditions:
TC = 25 °C
D = 0,
SSiinngglleePPuullssee
00..0011
Parameter: tp
1100EE--33
11EE--66
0.1
1
10
100
1000
1100EE--66
110000EE--66
11EE--33
1100EE--33
110000EE--33
11
Drain-Source Voltage, VDS (V)
TTiimmee,, tt ((ss))
pp
Figure 21. Transient Thermal Impedance
(Junction - Case)
Figure 22. Safe Operating Area
150
125
100
75
250
Conditions:
TJ = 25 °C
VDD = 500 V
RG(ext) = 2.5 Ω
VGS = -4V/+15 V
FWD = C3M0120100J
L = 156 μH
Conditions:
TJ = 25 °C
VDD = 700 V
RG(ext) = 2.5 Ω
VGS = -4V/+15 V
FWD = C3M0120100J
L = 156 μH
200
150
100
50
ETotal
ETotal
EOn
EOn
50
25
EOff
EOff
0
0
0
5
10
15
20
25
0
5
10
15
20
25
Drain to Source Current, IDS (A)
Drain to Source Current, IDS (A)
Figure 23. Clamped Inductive Switching Energy vs.
Drain Current (VDD = 500V)
Figure 24. Clamped Inductive Switching Energy vs.
Drain Current (VDD = 700V)
6
C3M0120100J Rev. -, 04-2017
CREE [ CREE, INC ]
