LAA108
MANUFACTURING INFORMATION
Soldering
Washing
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
RoHS
2002/95/EC
Pb
e3
MECHANICAL DIMENSIONS
8-Pin DIP Through-Hole Package
PC Board Pattern
9.652 0.381
(0.380 0.015ꢀ
8-0.800 DIA.
(8-0.031 DIA.ꢀ
7.620 0.254
(0.300 0.010ꢀ
2.540 0.127
(0.100 0.005ꢀ
2.540 0.127
(0.100 0.005ꢀ
9.144 0.508
(0.360 0.020ꢀ
6.350 0.127
(0.250 0.005ꢀ
6.350 0.127
(0.250 0.005ꢀ
3.302 0.051
(0.130 0.002ꢀ
7.620 0.127
(0.300 0.005ꢀ
0.457 0.076
7.620 0.127
(0.300 0.005ꢀ
(0.018 0.003ꢀ
7.239 TYP.
(0.285ꢀ
0.254 TYP
(0.01ꢀ
4.064 TYP
(0.160ꢀ
Dimensions
mm
(inchesꢀ
0.889 0.102
(0.035 0.004ꢀ
Recommended PCB Land Pattern
8-Pin Surface Mount Package
9.652 0.381
(0.380 0.015ꢀ
2.54
(0.10ꢀ
0.635 0.127
(0.025 0.005ꢀ
2.540 0.127
3.302 0.051
(0.100 0.005ꢀ
(0.130 0.002ꢀ
8.90
(0.3503ꢀ
9.525 0.254
(0.375 0.010ꢀ
1.65
(0.0649ꢀ
6.350 0.127
(0.250 0.005ꢀ
7.620 0.254
(0.300 0.010ꢀ
0.457 0.076
(0.018 0.003ꢀ
0.65
(0.0255ꢀ
0.254 0.127
(0.010 0.0005ꢀ
4.445 0.127
(0.175 0.005ꢀ
Dimensions
mm
(inchesꢀ
0.813 0.120
(0.032 0.004ꢀ
8 Pin Flatpack Package
Recommended PCB Land Pattern
2.286 MAX.
(0.090 MAX.ꢀ
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAXꢀ
2.540 0.127
(0.100 0.005ꢀ
2.54
(0.10ꢀ
0.635 0.127
(0.025 0.005ꢀ
7.620 0.254
(0.300 0.010ꢀ
6.350 0.127
(0.250 0.005ꢀ
9.398 0.127
(0.370 0.005ꢀ
8.70
(0.3425ꢀ
1.55
(0.0610ꢀ
0.203 0.013
(0.008 0.0005ꢀ
9.652 0.381
(0.380 0.015ꢀ
0.65
(0.0255ꢀ
2.159 0.025
(0.085 0.001ꢀ
0.457 0.076
(0.018 0.003ꢀ
Dimensions
mm
0.864 0.120
(0.034 0.004ꢀ
(inchesꢀ
R02
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