CPC1393
Manufacturing Information
Soldering
Washing
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
RoHS
2002/95/EC
Pb
e3
MECHANICAL DIMENSIONS
0.254
(0.010)
PC Board Pattern (Top View)
4-Pin DIP (”G” Suffix)
3.30 0.050
(0.130 0.002)
0.991
(0.039)
6 - 0.800 DIA.
2.540 0.127
(6 - 0.031 DIA.)
(0.100 0.005)
6.350 0.127
(0.250 0.005)
7.620 0.127
(0.300 0.005)
PIN 1
4.572 0.127
(0.180 0.005)
9.144 0.508
(0.360 0.020)
6.350 0.127
9º (ALL)
(0.250 0.005)
7.620 0.254
9º (ALL)
(0.300 0.010)
1.651
(0.065)
0.457 0.076
(0.018 0.003)
0.508
(0.020)
3.175
(0.125)
Dimensions
mm
(inches)
2.540 0.127
(0.100 0.005)
PC Board Pattern (Top View)
4-Pin DIP “V” Package
0.254
(0.010)
10.160 0.508
(0.400 0.020)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.991
(0.039)
2.540 0.127
(0.100 0.005)
3.30 0.050
(0.130 0.002)
6.350 0.050
(0.250 0.002)
10.160 0.127
(0.400 0.005)
6.350 0.127
(0.250 0.005)
4.572 0.050
(0.180 0.002)
Pin 1
9º (ALL)
7.620 0.254
(0.300 0.010)
9º (ALL)
1.651
(0.065)
0.457 0.076
(0.018 0.003)
0.127
(0.005)
2.92
(0.115)
2.540 0.050
(0.100 0.002)
Dimensions
mm
(inches)
R03
www.clare.com
5
CLARE [ CLARE ]
