CS5302
APPLICATION DIAGRAM – CS5302
300 nH
+5.0 V
+
+
+
1.0 µF
6SP680M
+12 V
1.0 µF
V
Q1
Q3
OUT
Q2
Q4
ENABLE
470 nH
61.9 k
1.0 nF 1.0 nF
7.5 k
R
COMP
OSC
CCL
V
V
FB
DRP
CS1
CS2
V
CCL1
V
8 ×
4SP820M
GATE(L)1
25.5 k
GND1
12.7 k
GATE(H)1
CS
REF
V
CCH1
PWRGD
LGND
SS
12 ×
10 µF cer
N/C
ID0
PWRGD
V
V
V
V
CCL2
ID1
ID2
V
ID3
LIM
0.1 µF
Gate(L)2
V
V
ID0
GND2
I
Gate(H)2
V
CCH2
ID1
REF
V
ID2
V
ID3
Q5
Q7
4.32 k
1.0 k
Q6
0.1 µF
470 nH
Q8
25.5 k
25.5 k
.01 µF
.01 µF
.01 µF
5.0 V to 1.6 V, 35 A Converter
ABSOLUTE MAXIMUM RATINGS*
Rating
Value
Unit
°C
Operating Junction Temperature
Lead Temperature Soldering:
Storage Temperature Range
150
Reflow: (SMD styles only) (Note 1.)
230 peak
–65 to +150
2.0
°C
°C
ESD Susceptibility (Human Body Model)
kV
1. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
ABSOLUTE MAXIMUM RATINGS
Pin Name
Pin Symbol
V
MAX
V
MIN
I
I
SINK
SOURCE
Power for Logic
V
16 V
16 V
16 V
20 V
20 V
–0.3 V
–0.3 V
–0.3 V
–0.3 V
–0.3 V
N/A
50 mA
CCL
Power for Gate(L)1
Power for Gate(L)2
Power Gate(H)1
Power for Gate(H)2
V
CCL1
V
CCL2
CCH1
CCH2
N/A
N/A
N/A
N/A
1.5 A, 1.0 µs 200 mA DC
1.5 A, 1.0 µs 200 mA DC
1.5 A, 1.0 µs 200 mA DC
1.5 A, 1.0 µs 200 mA DC
V
V
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