Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
Thermal Data
16 Lead
PDIP
16L
SO Wide
Lead Count
Metric
English
RΘ
RΘ
typ
typ
42
80
23
˚C/W
˚C/W
Max
19.69
10.50
Min
Max Min
JC
JA
16 Lead PDIP
16L SO Wide
18.67 .775 .735
10.10 .413 .398
105
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
1.77 (.070)
1.14 (.045)
8.26 (.325)
7.62 (.300)
2.54 (.100) BSC
3.68 (.145)
2.92 (.115)
0.39 (.015)
MIN.
.356 (.014)
.203 (.008)
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
REF: JEDEC MS-001
D
All specs are the same.
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
0.32 (.013)
0.23 (.009)
1.27 (.050)
0.40 (.016)
0.30 (.012)
0.10 (.004)
D
REF: JEDEC MS-013
Ordering Information
Part Number
CS3524AGN16
CS3524AGDW16
CS3524AGDWR16
Description
16 Lead PDIP
16 Lead SO Wide
16 Lead SO Wide (tape & reel)
Ch erry Sem icon du ctor Corporation reserves th e
righ t to m ake ch an ges to th e specification s with ou t
n otice. Please con tact Ch erry Sem icon du ctor
Corporation for th e latest available in form ation .
© 1999 Cherry Semiconductor Corporation
Rev. 10/28/96
6
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
