TYPE
MODEL
PAGE
6/9
SMV0805M□□□KRR
CITATION
DATE Feb. 03, 2009
SUBJECT
S
o
lde
ring
REV.
C01
☆
IR reflow Pb Free Process suggestion profile
(1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150
(2) Ramp-up rate (217 to Peak) + 3 /second max
(3) Temp. maintain at 175 +/-25 180 seconds max
(4) Temp. maintain above 217 ℃ 60-150 seconds
μ
m
℃
℃
℃
10~20
℃ +20℃/ -10 ℃ time within 5 ℃of actually peak temperature (tp)
(5) Peak temperature range 245
seconds
(6) Ramp down rate +6
℃/second max.
※
Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the
manufacturing process, and the specification of the reflow furnace.
5.5 Resistance to soldering heat-High Temperature Resistance:260
5.6 Hand Soldering
℃,10sec-3times.
In hand soldering of the Varistors. Large temperature gradient between preheated the Varistors and the tip of
soldering iron may cause electrical failures and mechanical damages such as crackings or breakings of the
devices. The soldering shall be carefully controlled and carried out so that the temperature gradient is kept
minimum with following recommended conditions for hand soldering.
5.6.1 Recommended Soldering Condition 1
（1） Solder ：
0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core. Rosin-based and
non-activated flux is recommended.
（2） Preheating
The Varistors shall be preheated so that Temperature Gradient between the devices and the tip of
soldering iron is 150℃ or below.
CERAMATE [ CERAMATE TECHNICAL ]
