NE5510179A
TYPICAL PERFORMANCE CURVES (TA = 25°C)
OUTPUT POWER, DRAIN CURRENT,
EFFICIENCY, AND POWER ADDED
EFFICIENCY VS. GATE TO SOURCE
VOLTAGE
OUTPUT POWER, DRAIN CURRENT,
EFFICIENCY, AND POWER ADDED
EFFICIENCY VS. INPUT POWER
31
31
30
29
28
27
26
1250
1000
750
1250
PO = 29.7 dBm
PMAX = 30.1 dBm
26
21
16
11
6
1000
750
500
250
0
VDS = 3.5 V,
P
OUT
V
I
DS = 3.5 V,
DQ = 200 mA,
freq = 1.9 GHz
freq = 1.9 GHz,
PIN = 22 dBm
POUT
I
DS
100
500
100
50
0
I
D
η
η
50
0
250
0
η
ADD
η
ADD
APC
1.0
2.0
3.0
0.0
0
5
10
15
20
25
4.0
Gate to Source Voltage, VGS (V)
Input Power, PIN (dBm)
OUTPUT POWER, DRAIN CURRENT,
EFFICIENCY, AND POWER ADDED
EFFICIENCY VS. GATE TO SOURCE
VOLTAGE
OUTPUT POWER, DRAIN CURRENT,
EFFICIENCY, AND POWER ADDED
EFFICIENCY VS. INPUT POWER
30
30
29
28
27
26
25
1250
1000
750
500
250
0
30
1250
1000
750
500
250
0
P
O
= 28.7 dBm
P
MAX = 29.0 dBm
25
20
15
10
5
V
DS = 2.8 V,
freq = 1.9 GHz,
IN = 22 dBm
P
OUT
V
I
DS = 2.8 V,
DQ = 200 mA,
freq = 1.9 GHz
P
POUT
I
ds
100
50
0
100
50
0
I
D
η
η
η
ADD
η
ADD
APC
1.0
0
5
10
15
20
25
2.0
3.0
0.0
4.0
Input Power, PIN (dBm)
Gate to Source Voltage, VGS (V)
P.C.B. LAYOUT1 (Units in mm)
4.0
1.7
Drain
Gate
Source
Through hole φ 0.2 × 33
Note:
0.5
0.5
1. Use rosin or other material to prevent solder from penetrating
through-holes.
6.1
CEL [ CALIFORNIA EASTERN LABS ]
