NE3510M04
TYPICAL CHARACTERISTICS (TA = +25$C, unless otherwise specified)
TOTAL POWER DISSIPATION
vs. AMBIENT TEMPERATURE
DRAIN CURRENT vs.
GATE TO SOURCE VOLTAGE
100
90
80
70
60
50
40
30
20
250
200
150
100
50
V
DS = 2 V
Mounted on Glass Epoxy PCB
(1.08 cm2 = 1.0 mm (t) )
10
0
–1.0
–0.8
–0.6
–0.4
–0.2
0
0
50
100
150
200
($C)
250
Ambient Temperature T
A
Gate to Source Voltage VGS (V)
MINIMUM NOISE FIGURE,
ASSOCIATED GAIN vs. FREQUENCY
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
100
90
80
70
60
50
40
30
20
10
0
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
24
22
20
18
16
14
12
10
8
V
= 2 V
I
D
D=S 15 mA
V
GS = 0 V
–0.1 V
–0.2 V
Ga
–0.3 V
–0.4 V
–0.5 V
NFmin
6
4
–0.6 V
–0.7 V
2
0
1
2
3
4
5
0
5
10
15
0
Frequency f (GHz)
Drain to Source Voltage VDS (V)
MINIMUM NOISE FIGURE,
ASSOCIATED GAIN vs. DRAIN CURRENT
MINIMUM NOISE FIGURE,
ASSOCIATED GAIN vs. DRAIN CURRENT
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
24
22
20
18
16
14
12
10
8
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
24
22
20
18
16
14
12
10
8
f = 2.0 GHz
f = 4.0 GHz
V
DS = 2 V
VDS = 2 V
G
a
G
a
NFmin
NFmin
6
6
4
4
0.1
2
0.1
2
0.0
0.0
0
0
0
5
10
15
20
25
30
35
0
5
10
15
20
25
(mA)
30
35
Drain Current I
D
(mA)
Drain Current I
D
Remark The graphs indicate nominal characteristics.
3
Data Sheet PG10676EJ01V0DS
CEL [ CALIFORNIA EASTERN LABS ]
