ADS5510
www.ti.com
SLAS499–JANUARY 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION(1)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESIGNATOR
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
PRODUCT PACKAGE-LEAD
HTQFP-64(2)
ADS5510
ADS5510IPAP
Tray, 160
PAP
–40°C to 85°C
ADS5510I
PowerPAD
ADS5510IPAPR
Tape and Reel, 1000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) Thermal pad size: 3,5 mm x 3,5 mm (min), 4 mm x 4 mm (max). θJA = 21.47°C/W and θJC = 2.99°C/W, when used with 2 oz. copper
trace and pad soldered directly to a JEDEC standard, four-layer, 3 in x 3 in PCB.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
UNIT
AVDD to AGND, DRVDD to DRGND
AGND to DRGND
–0.3 to 3.7
V
V
VSS
Supply Voltage
±0.1
–0.3 to minimum (AVDD + 0.3, 3.6)
–0.3 to DRVDD
–0.3 to DRVDD
–40 to 85
(2)(3)
Analog input to AGND
Logic input to DRGND
V
V
Digital data output to DRGND
Operating temperature range
Junction temperature
V
°C
°C
°C
TJ
105
Tstg
Storage temperature range
–65 to 150
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) If the input signal can exceed 3.6 V, then a resistor greater than or equal to 25 Ω should be added in series with each of the analog
input pins to support input voltages up to 3.8 V. For input voltages above 3.8 V, the device can only handle transients and the duty cycle
of the overshoot should be limited to less than 5% for inputs up to 3.9 V.
(3) The overshoot duty cycle can be defined as the ratio of the total time of overshoot to the total intended device lifetime, expressed as a
percentage. The total time of overshoot is the integrated time of all overshoot occurrences over the lifetime of the device.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
MIN
TYP
MAX
UNIT
Supplies
AVDD
Analog supply voltage
3
3
3.3
3.3
3.6
3.6
V
V
DRVDD
Output driver supply voltage
Analog input
Differential input range
2.3
VPP
V
VCM
Input common-mode voltage(1)
1.45
1.55
1.65
Digital Output
Maximum output load
10
pF
Clock Input
DLL ON
60
2
125
80
ADCLK input sample rate (sine wave) 1/tC
MSPS
VPP
DLL OFF
Clock amplitude, sine wave, differential
Clock duty cycle
1
3
50%
TA
Open free-air temperature range
–40
85
°C
(1) Input common-mode should be connected to CM.
2
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