A D V A N C E I N F O R M A T I O N
CONNECTION DIAGRAM
48-Ball FBGA
(Top View, Balls Facing Down)
A6
B6
C6
D6
E6
F6
G6
H6
A13
A12
A14
A15
A16
BYTE# DQ15/A-1 VSS
A5
A9
B5
A8
C5
D5
E5
F5
G5
H5
A10
A11
DQ7
DQ14
DQ13
DQ6
A4
B4
C4
D4
E4
F4
G4
H4
WE# RESET#
NC
NC
DQ5
DQ12
VCC
DQ4
A3
B3
C3
D3
E3
F3
G3
H3
RY/BY#
NC
NC
NC
DQ2
DQ10
DQ11
DQ3
A2
A7
B2
C2
A6
D2
A5
E2
F2
G2
H2
A17
DQ0
DQ8
DQ9
DQ1
A1
A3
B1
A4
C1
A2
D1
A1
E1
A0
F1
G1
H1
CE#
OE#
VSS
SSOP). The package and/or data integrity may be
compromised if the package body is exposed to tem-
peratures about 150°C for prolonged periods of time.
Special Handling Instructions for FBGA
Packages
Special handling is required for Flash Memory products
in molded packages (TSOP, BGA, PLCC, PDIP,
April 13, 2005 Rev. A Amend. +1
Am29SL400D
5
AMD [ AMD ]
