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A400DT12VI 参数 Datasheet PDF下载

A400DT12VI图片预览
型号: A400DT12VI
PDF下载: 下载PDF文件 查看货源
内容描述: 4兆位( 512K的×8位/ 256千×16位) CMOS 1.8伏只超低电压闪存 [4 Megabit (512 K x 8-Bit/256 K x 16-Bit) CMOS 1.8 Volt-only Super Low Voltage Flash Memory]
分类和应用: 闪存
文件页数/大小: 41 页 / 775 K
品牌: AMD [ AMD ]
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A D V A N C E I N F O R M A T I O N  
TABLE OF CONTENTS  
Product Selector Guide . . . . . . . . . . . . . . . . . . . . .4  
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Special Handling Instructions for FBGA Packages .................. 5  
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . .6  
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Ordering Information . . . . . . . . . . . . . . . . . . . . . . .7  
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . .8  
Table 1. Am29SL400D Device Bus Operations ................................8  
Word/Byte Configuration .......................................................... 8  
Requirements for Reading Array Data ..................................... 8  
Writing Commands/Command Sequences .............................. 9  
Program and Erase Operation Status ...................................... 9  
Standby Mode .......................................................................... 9  
Automatic Sleep Mode ............................................................. 9  
RESET#: Hardware Reset Pin ................................................. 9  
Output Disable Mode .............................................................. 10  
Table 2. Am29SL400DT Top Boot Block Sector Address Table .....10  
Table 3. Am29SL400DB Bottom Boot Block Sector Address Table 10  
Autoselect Mode ..................................................................... 11  
Table 4. Am29SL400D Autoselect Codes (High Voltage Method) ..11  
Sector Protection/Unprotection ............................................... 11  
Temporary Sector Unprotect .................................................. 11  
Figure 1. In-system Sector Protection/Unprotection Algorithms ..... 12  
Figure 2. Temporary Sector Unprotect Operation........................... 13  
Hardware Data Protection ...................................................... 13  
Reading Toggle Bits DQ6/DQ2 ............................................... 19  
Figure 6. Toggle Bit Algorithm........................................................ 20  
DQ5: Exceeded Timing Limits ................................................ 20  
DQ3: Sector Erase Timer ....................................................... 20  
Table 6. Write Operation Status ..................................................... 21  
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 22  
Figure 7. Maximum Negative Overshoot Waveform ...................... 22  
Figure 8. Maximum Positive Overshoot Waveform........................ 22  
Operating Ranges. . . . . . . . . . . . . . . . . . . . . . . . . 22  
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 23  
Figure 9. I  
Current vs. Time (Showing Active and Automatic  
CC1  
Sleep Currents).............................................................................. 24  
Figure 10. Typical I vs. Frequency ........................................... 24  
CC1  
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
Figure 11. Test Setup..................................................................... 25  
Table 7. Test Specifications ........................................................... 25  
Key to Switching Waveforms .................................................. 25  
Figure 12. Input Waveforms and Measurement Levels ................. 25  
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 26  
Read Operations .................................................................... 26  
Figure 13. Read Operations Timings ............................................. 26  
Figure 14. RESET# Timings .......................................................... 27  
Word/Byte Configuration (BYTE#) ........................................ 28  
Figure 15. BYTE# Timings for Read Operations............................ 28  
Figure 16. BYTE# Timings for Write Operations............................ 28  
Erase/Program Operations ..................................................... 29  
Figure 17. Program Operation Timings.......................................... 30  
Figure 18. Chip/Sector Erase Operation Timings .......................... 31  
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . 32  
Figure 19. Data# Polling Timings (During Embedded Algorithms). 32  
Figure 20. Toggle Bit Timings (During Embedded Algorithms)...... 32  
Figure 21. DQ2 vs. DQ6................................................................. 33  
Temporary Sector Unprotect .................................................. 33  
Figure 22. Temporary Sector Unprotect Timing Diagram .............. 33  
Figure 23. Sector Protect/Unprotect Timing Diagram .................... 34  
Alternate CE# Controlled Erase/Program Operations ............ 35  
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 36  
Figure 24. Alternate CE# Controlled Write Operation Timings ...... 36  
Erase and Programming Performance . . . . . . . 37  
Low V Write Inhibit .............................................................. 13  
CC  
Write Pulse “Glitch” Protection ............................................... 13  
Logical Inhibit .......................................................................... 13  
Power-Up Write Inhibit ............................................................ 13  
Command Definitions . . . . . . . . . . . . . . . . . . . . . 13  
Reading Array Data ................................................................ 13  
Reset Command ..................................................................... 13  
Autoselect Command Sequence ............................................ 14  
Word/Byte Program Command Sequence ............................. 14  
Unlock Bypass Command Sequence ..................................... 14  
Figure 3. Program Operation .......................................................... 15  
Chip Erase Command Sequence ........................................... 15  
Sector Erase Command Sequence ........................................ 15  
Figure 4. Erase Operation............................................................... 16  
Table 5. Am29SL400D Command Definitions ................................17  
Write Operation Status ........................................................... 18  
DQ7: Data# Polling ................................................................. 18  
Figure 5. Data# Polling Algorithm ................................................... 18  
RY/BY#: Ready/Busy# ........................................................... 18  
DQ6: Toggle Bit I .................................................................... 19  
DQ2: Toggle Bit II ................................................................... 19  
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 37  
TSOP Pin and BGA Package Capacitance . . . . . 37  
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 38  
FBA048—48-Ball Fine-Pitch Ball Grid Array (FBGA) 6 x 8 mm  
Package .................................................................................. 38  
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 39  
April 13, 2005 Rev. A Amend. +1  
Am29SL400D  
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