REVISIONS
LTR
A
B
C
D
DESCRIPTION
Add device type 02; editorial changes throughout. Redrawn.
Update boilerplate. Add device types 03 and 04. Add case outline M.
Editorial changes throughout.
Add 05 device. Removed some parameters from table IIB. Updated
boilerplate. ksr
Added equation to footnote 2/, made corrections to table IB. Changed
sample size in paragraph 4.4.1. Removed (Dose Rate Induced
latchup testing) and (Dose Rate Upset testing) paragraphs. Updated
boilerplate. ksr
Change 1.3 Maximum junction temperature from 175°C to 150°C.
Added footnote 2/ to Figure 2 for the T and M case outlines. Add die
information per Appendix A. ksr
Correct bond pad symbol on figure A-1, pad #45 I/O vs GND. Updated
boilerplate. ksr
Added additional information to footnote 2 on figure 2 Terminal
connections, for case outlines T and M. Added note 3 to figure A-1
A1020B and RH1020 Bond Pad Locations and Functions. ksr
DATE (YR-MO-DA)
93-06-23
94-06-30
98-04-06
98-07-10
APPROVED
M. A. Frye
M. A. Frye
Raymond Monnin
Raymond Monnin
E
98-09-21
Raymond Monnin
F
G
04-03-08
05-05-13
Raymond Monnin
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
G
15
G
16
G
17
G
18
REV
SHEET
PREPARED BY
Tim H. Noh
CHECKED BY
Kenneth Rice
APPROVED BY
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
Tim H. Noh
DRAWING APPROVAL DATE
92-06-23
REVISION LEVEL
G
G
19
G
20
G
21
G
1
G
22
G
2
G
23
G
3
G
4
G
5
G
6
G
7
G
8
G
9
G
10
G
11
G
12
G
13
G
14
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
MICROCIRCUIT, MEMORY, DIGITAL,
CMOS, FIELD PROGRAMMABLE GATE
ARRAY, 2,000 GATES, MONOLITHIC
SILICON
SIZE
CAGE CODE
A
SHEET
67268
1
5962-90965
OF
23
5962-E336-05
DSCC FORM 2233
APR 97
ACTEL [ Actel Corporation ]
