SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 5
ABC'S DWG No.
ABC'S ITEM No.
AL1005□□□□L□
THIN FILM CHIP INDUCTOR
Ⅸ﹒RELIABILITY TEST:
Test item
Specification
Test condition
More than 90% of the
terminal electrode
Shall be covered
Preheat : 150±25℃ for 60 seconds
Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent
Solder temp. : 235±5℃
Solderability
With fresh solder.
Flux : Rosin
Dip time : 4±1 seconds
Inductance shall
not change more
than ±20%
Room temp.
15 minutes
-25±2 ℃
30 minutes
Thermal shock test
( Temp. cycle )
Room temp.
15 minutes
85±2 ℃
30 minutes
Total : 50 cycles
Temperature : 40±2℃
Humidity : 90 ~ 95%
Applied current : Per spec.
Time : 500 hours
Humidity
Resistance test
Temperature : 85±2℃
Applied current : Per spec.
Time : 500 hours
High temp.
Resistance test
AE-001A