SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 1
THIN FILM CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
AL1005□□□□L□
Ⅰ﹒
CONFIGURATION & DIMENSIONS
:
A
D
D
C
B
I
G
I
Unit : m/m
( PCB Pattern )
Series
AL1005
A
1.00±0.05
B
0.50±0.05
C
0.32±0.05
D
0.20±0.10
G
0.4
H
0.4
I
0.5
Ⅱ﹒
SCHEMATIC DIAGRAM
:
Ⅲ﹒
MATERIALS
:
a
﹒
Body
:
Ceramic
b
﹒
Internal conductor
:
Cu
c
﹒
Terminal electrode
:
Cu/Ni/Sn (Lead content 100ppm max.)
d
﹒
Remark
:
Lead content 1000ppm max. include ceramic
a
b
Ⅳ﹒
GENERAL SPECIFICATION
:
a
﹒
Storage temp.
:
-40 ---- +105
℃
b
﹒
Operating temp.
:
-25 ---- +85
℃
c
﹒
Terminal strength
:
F
Type
AL1005
d
﹒
Solderability
:
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AE-001A
F ( kgf )
0.3
Time ( sec )
Temperature (
℃
)
250
50sec max.
Peak Temp
:
260
℃
max.
Max time above 230
℃ :
50sec max.
Max time above 200
℃ :
70sec max.
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)
℃
/ sec max.
Peak Temperature:
260℃
230℃
30±5
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
H
c
250