CHAPTER 2 OUTLINE (µPD78070AY)
2.7 Outline of Function
Item
Function
Internal
memory
ROM
None
High-speed RAM
Buffer RAM
1024 bytes
32 bytes
Memory space
64 Kbytes
8 bits × 8 × 4 banks
General register
Minimum
instruction
execution
time
With main system clock selected 0.4 µs/0.8 µs/1.6 µs/3.2 µs/6.4 µs/12.8 µs (@ 5.0-MHz operation)
With subsystem clock selected
122 µs (@ 32.768-kHz operation)
Instruction set
• 16-bit operation
• Multiply/divide (8-bit × 8-bit, 16-bit/8-bit)
• Bit manipulate (set, reset, test, and Boolean operation)
• BCD adjust, etc.
I/O port
Total
: 61
: 2
• CMOS input
• CMOS input/output : 51
• N-ch open drain I/O : 8
A/D converter
D/A converter
Serial interface
8-bit resolution × 8 channels
8-bit resolution × 2 channels
• 3-wire serial I/O/2-wire serial I/O/I2C bus mode selection
enable
: 1 channel
• 3-wire serial I/O mode (maximum 32-byte on-chip automatic
transmit/receive function)
: 1 channel
: 1 channel
• 3-wire serial I/O/UART mode selection enable
Timer
• 16-bit timer/event counter : 1 channel
• 8-bit timer/event counter : 4 channels
• Watch timer
: 1 channel
: 1 channel
• Watchdog timer
Timer output
Clock output
5 outputs: (14-bit PWM output enable: 1, 8-bit PWM output enable: 2)
19.5 kHz, 39.1 kHz, 78.1 kHz, 156 kHz, 313 kHz, 625 kHz, 1.25 MHz,
2.5 MHz, 5.0 MHz (@ 5.0-MHz operation with main system clock)
32.768 kHz (@ 32.768-kHz operation with subsystem clock)
Buzzer output
1.2 kHz, 2.4 kHz, 4.9 kHz, 9.8 kHz
(@ 5.0-MHz operation with main system clock)
Vectored
interrupt
source
Maskable
Internal: 15
External: 7
Non-maskable
Software
Internal: 1
1
Test input
Internal: 1
Power supply voltage
Operating ambient temperature
Package
VDD = 2.7 to 5.5 V
TA = –40 to +85°C
• 100-pin plastic QFP (Fine pitch) (14 × 14 mm, resin thickness 1.45 mm)
• 100-pin plastic LQFP (Fine pitch) (14 × 14 mm, resin thickness 1.4 mm)Note
• 100-pin plastic QFP (14 × 20 mm, resin thickness 2.7 mm)
Note Under planning
53
ETC [ ETC ]
