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LC5200D 参数 Datasheet PDF下载

LC5200D图片预览
型号: LC5200D
PDF下载: 下载PDF文件 查看货源
内容描述: SANKEN半导体 [SANKEN SEMICONDUCTORS]
分类和应用: 半导体
文件页数/大小: 226 页 / 4860 K
品牌: ETC [ ETC ]
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4 Diodes  
Application Note  
General Description  
Surface-Mount Diodes  
(1) Lead Forming  
(Part Number Type: SJP)  
When forming leads, hold the lead wire on the main body's side so as  
to prevent stress from being applied to the main body.  
Soldering (common to flow and reflow)  
i) Use rosin based flux. Never use acidic fluxes.  
Hold  
ii) To prevent a large thermal stress, preheat within 1 to 2 minutes at  
Axial type  
150°C and solder within the usable range shown below.  
300  
280  
260  
240  
220  
200  
180  
160  
Bend  
Hold  
Frame type  
Bend  
0
10  
20  
30  
40  
50  
60  
70  
80  
(2) Mounting  
To mount a frame-type diode on a heatsink, use its screw hole. Do not  
fix its resin body as the silicon chip may get broken.  
Time (sec)  
(3) Temperature Measurement  
iii) For using a soldering iron, use the following references:  
Temperature of soldering iron tip:  
For an axial type diode, measure the temperature of the lead wire on  
the main body side. The thermocouple to be used must be as thin as  
possible (approximately φ0.125mm).  
Lower than 300ºC  
(Power of the soldering  
iron: 30W or lower)  
(4) Temperature Rise Consideration  
The soldering tip must  
be as thin as possible.  
A diode’s temperature increases due to losses from forward current,  
reverse current and reverse recovery time.  
Soldering time: Less than 10 seconds  
In normal use, losses are mainly attributable to forward current and  
voltage. However, in high frequency circuits such as switching power  
supplies, losses due to reverse recovery time also occurs. Moreover, in  
diodes having large reverse currents like Schottky barrier diode losses  
due to reverse current cannot be disregarded.  
Reference  
SJP Series Copper Laminate Pattern  
(Unit : mm)  
Forward loss tends to decrease at high temperatures. However,  
reverse loss tends to increase at high temperatures. Therefore, it is  
necessary to consider the ambient temperature when verifying  
operation.  
2.0  
2.0  
(5) Inrush Current  
4.0 to 4.2  
In a capacitor-input type rectifier circuit, inrush current flows when the  
power supply is switched on. The peak value of this inrush current  
shall be set less than peak forward surge current IFSM (I2t can also be  
obtained but set the minimum pulse width to 1 msec). The value of  
IFSM is guaranteed for a single shot only. If the inrush current is  
repeated within a short period of time, the derating has to be taken into  
account.  
(6) Peak Value Current  
Considering normal use, limit of the peak value current must be set to  
10 times of the average current IF (AV). If the peak value increases.  
the diode's forward loss also increases. In this case, check the  
temperature rise.  
Carefully study the mounting method when the usage environment is prone to  
creeping discharge.  
Contact us if there is any unclear point.  
Diodes  
201  
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