Holtite® Series Zero Profile Solderless DIP Sockets on Reel
A
322-HCS5P2-314
FEATURES:
PERFORMANCE SPECIFICATIONS:
The solderless zero-profile Holtite® contact is designed to be press-fit into
the plated-thru hole of a printed wiring board. This unique design allows
the plated-thru hole to become the component socket. The outer conical
shape of the Holtite® contact sizes the plated-thru hole when pressed into
place. The precision-machined geometry allows for the controlled
displacement of plated material without damaging the hole, or affecting the
normal mechanical and electrical contact performance.
MECHANICAL
Vibration ........................Passed MIL-STD-202, Method 204, 20 G’s
Durability ...................... Passed MIL-STD-1344, Method 2016, 50 cycles
Insertion Force .............. 92 Grams (3.2 oz.) average with a .018" (0,46)
pol. steel pin and .043" (1,09) plated thru hole
Withdrawal Force ..........103 Grams (3.6 oz.) average with a .018" (0,46)
pol. steel pin and .043" (1,09) plated thru hole
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Lowest socket profile
Contact Retention
in Board ..................... 5 Lb. minimum
The profile of the printed wiring board with the Holtite® contact
installed is less than the length of the IC or component lead,
offering the lowest socketing profile, permitting card rack spacing
as low as .400", identical to that of direct soldering.
ELECTRICAL
Contact Resistance ........ 10 Milliohms max.
Contact Rating .............. 3 Amps
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Precision-machined, tapered-entry, four finger contact
The underlying contact design used in the Holtite® system has a
proven record of reliability after more than fifteen years' usage in
both commercial and military applications.
ENVIRONMENTAL
Humidity ........................Passed MIL-STD-202, Method 106
Thermal Shock .............. Passed MIL-STD-202, Method 107, Cond. F
Operation Temp. ............Gold contact -55°C to +125°C,
Tin/lead contact -55°C to +105°C
Retains minimum component lead lengths
The socketing technique provides the shortest distance between the
component seating plane and the contact engagement zone for
maximum retention of short component leads.
•
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Maximum heat dissipation
B Dim.
Contact Area Dia.
Open contact design permits air flow through the board,
increasing heat dissipation and extending component life.
Solderless, gas-tight, press-fit insertion
The solderless, pluggable system saves the time and cost of
soldering, plus eliminating the potential for heat damage, warpage
and corrosive residue contamination..
Glass
Epoxy
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Removes artwork design restrictions
Substrate
Use of the Holtite® solderless system removes certain artwork
restrictions necessary for wave soldering and solder joint
construction. Line spacing can be made as tight as electrical
parameters allow without solder bridging or the need for
soldermask. Terminal areas can be reduced in diameter without the
need of a base for solder fillets. Ground plane areas can be increased
without concern for heat-induced warpage.
C Dim.
Max.
Profile
Plated
Thru Hole
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Immediate conversion to the Holtite® system
Existing printed wiring designs can be converted by simply
changing the drilled hole diameter prior to plating.
A Dim.
Finished Hole Dia.
MATERIAL SPECIFICATIONS:
Carrier Strip .................. Mylar
Contact .......................... Beryllium copper
Finish ..............................Gold or tin/lead plated
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
Quality & Innovation From The
Product Group
A24
(901) 682-8221 FAX (901) 537-8805
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