Avant Electronics
SBN0064G
Dot-matrix STN LCD 64-SEGMENT Driver with 64-row x 64-column Display Data Memory
3.2
The SBN0064G pad placement
62 SEG10
61 SEG11
60 SEG12
59 SEG13
58 SEG14
57 SEG15
56 SEG16
55 SEG17
54 SEG18
53 SEG19
VSS 78
DB0 79
DB1 80
DB2 81
DB3 82
DB4 83
DB5 84
DB6 85
DB7 86
52 SEG20
72 SEG0
71 SEG1
70 SEG2
69 SEG3
68 SEG4
67 SEG5
66 SEG6
65 SEG7
64 SEG8
63 SEG9
Pad 78
73 V
EE1
77 V3L
76 V2L
75 V5L
74 V0L
51 SEG21
50 SEG22
49 SEG23
48 SEG24
47 SEG25
46 SEG26
45 SEG27
44 SEG28
43 SEG29
42 SEG30
Y
3120µm
CS3 87
CS2B 88
CS1B 89
RSTB 90
R/W 91
C/D 92
CL 93
CLK2 94
CLK1 95
E 96
FRM 97
CSM 1
M 2
VDD 3
V3R 4
5
6
7
8
9
SEG62 10
SEG61 11
SEG60 12
SEG59 13
SEG58 14
SEG57 15
(0,0)
X
41 SEG31
40 SEG32
39 SEG33
38 SEG34
37 SEG35
36 SEG36
35 SEG37
34 SEG38
chip ID
Chip size : 3271
µm
x 3120
µm.
Pad size: 90
µm
x 90
µm.
33 SEG39
32 SEG40
31 SEG41
30 SEG42
SEG56 16
SEG55 17
SEG54 18
SEG53 19
SEG52 20
SEG51 21
SEG50 22
SEG49 23
SEG48 24
SEG47 25
SEG46 26
SEG45 27
SEG44 28
3271
µm
Note:
(1) The total pad number is 97.
(2) The chip ID is located at the lower left part of the chip.
(3) The chip ID of is 18005.
(4) The die origin is at the center of the chip.
(5) For chip_on_board bonding,
chip carrier
should be connected to VDD or
left open.
Chip carrier
is the metal pad to which the die is attached.
Fig.3 The pad placement
2005 May 20
6 of 37
SEG43 29
V
EE2
V2R
V5R
V0R
SEG63
data sheet (v3)
ETC [ ETC ]
