AD7804/AD7805/AD7808/AD7809
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
Plastic DIP (N-28)
Plastic DIP (N-16)
0.840 (21.33)
0.745 (18.93)
28
1
15
14
0.580 (14.73)
0.485 (12.32)
16
1
9
8
0.280 (7.11)
0.240 (6.10)
PIN 1
0.325 (8.25)
0.300 (7.62)
0.195 (4.95)
0.115 (2.93)
0.060 (1.52)
0.015 (0.38)
1.565 (39.70)
1.380 (35.10)
PIN 1
0.060 (1.52)
0.015 (0.38)
0.250
(6.35)
MAX
0.210 (5.33)
MAX
0.130
(3.30)
MIN
0.150
(3.81)
MIN
0.160 (4.06)
0.115 (2.93)
0.200 (5.05)
0.125 (3.18)
0.015 (0.381)
0.008 (0.204)
0.070 (1.77) SEATING
0.100
(2.54)
BSC
0.022 (0.558)
0.014 (0.356)
0.022 (0.558)
0.014 (0.356)
0.100
(2.54)
BSC
0.070 (1.77)
MAX
SEATING
PLANE
PLANE
0.045 (1.15)
0.625 (15.87)
0.600 (15.24)
0.195 (4.95)
0.125 (3.18)
SOIC (R-16)
0.015 (0.381)
0.008 (0.204)
0.4133 (10.50)
0.3977 (10.00)
SOIC (R-28)
16
9
28
15
1
8
0.2992 (7.60)
0.2914 (7.40)
0.1043 (2.65)
0.0926 (2.35)
0.4193 (10.65)
0.3937 (10.00)
0.0291 (0.74)
PIN 1
PIN 1
x 45°
0.0118 (0.30)
0.0040 (0.10)
0.0098 (0.25)
14
1
0.0500 (1.27)
0.0157 (0.40)
8°
0°
0.1043 (2.65)
0.0500
(1.27)
BSC
0.7125 (18.10)
0.6969 (17.70)
0.0192 (0.49)
0.0926 (2.35)
SEATING
PLANE
0.0125 (0.32)
0.0091 (0.23)
0.0291 (0.74)
0.0098 (0.25)
0.0138 (0.35)
x 45°
0.0500 (1.27)
8°
0°
0.0157 (0.40)
0.0118 (0.30)
0.0040 (0.10)
0.0192 (0.49)
0.0138 (0.35)
0.0500 (1.27)
BSC
0.0125 (0.32)
0.0091 (0.23)
SSOP (RS-28)
28
15
0.212 (5.38)
0.205 (5.207)
0.311 (7.9)
0.301 (7.64)
PIN 1
1
14
0.07 (1.78)
0.407 (10.34)
0.397 (10.08)
0.066 (1.67)
0.03 (0.762)
8°
0°
0.022 (0.558)
0.008 (0.203)
0.002 (0.050)
0.0256 (0.65)
BSC
0.015 (0.38)
0.010 (0.25)
0.009 (0.229)
0.005 (0.127)
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
REV. A
–27–
ETC [ ETC ]
