PFMD Polymeric PTC Resettable Fuse – Surface Mount
Typical Time to Trip at 23 °C
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High Density Circuit Board Application:
Hard disk drives,
NEW
PC motherboards
PC peripherals
Point-of-sale (POS) equipment
PCMCIA cards
100
10
9E
Packaged per EIA 481-2 standard
Approvals:
1
UL
CSA
recognition
pending
TÜV
approval
0.1
0.01
0.001
0.1
1
10
100
Fault current (Amps)
Dimensions
Solder Pad Layouts
Typical Part Marking
Represents total content. Layout may vary.
1.78
(0.070)
1.00
(0.039)
A
C
PART
IDENTIFICATION
3.15
2.5
(0.124)
B
(0.098)
110
MANUFACTURER'S
TRADEMARK
2.00
(0.079)
3.45
(0.136)
MIN
MIN
9E
SIDE
VIEW
TOP
D
VIEW
PFMD.035
PFMD.020, 050, 075, 110
Dimentions in mm / (inch)
Technical Data
Operating/Storage Temperature
-40°C to +85°C
Maximum Device Surface Temperature
in Tripped State
125°C
Passive Aging
+85°C, 1000 hours
±5% typical resistance change
Humidity Aging
Thermal Shock
Mechanical Shock
+85°C, 85% R.H. 1000 hours
+125°C/-40°C 10 times
MIL-STD-202, Method 213,
Condition 1 (100g, 6 seconds)
MIL-STD-202, Method 215
MIL-STD-883C, Method 2007.1,
Condition A
±5% typical resistance change
±10% typical resistance change
No resistance change
Solvent Resistance
Vibration
No change
No change
Terminal material
Solder-plated copper
Termination pad solderability
Meets EIA Specification RS-186-9E, ANSI/J-STD-002 Cat.3
Test Procedures And Requirements
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech.
Resistance
Verify dimensions and materials
In still air @ 23°C
Per PF physical description
Rmin ≤ R ≤ Rmax
Time to Trip
At 8 Amps , Vmax, 23°C
30 min. at Ihold
Vmax, Imax, 100 cycles
Vmax, 48 hours
T ≤ max. time to trip (seconds)
No trip
No arcing or burning
No arcing or burning
Hold Current
Trip Cycle Life
Trip Endurance
106
Schurter, Inc. Phone 707-778-6311 • Fax 707-778-6401 • E-mail info@schurterinc.com • Website http://www.schurterinc.com
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ETC [ ETC ]
