Surface Mounting Guide
MLC Chip Capacitors
WAVE SOLDERING
D2
D1
D3
D4
Case Size
0603
0805
1206
1210
D5
D1
3.10 (0.12)
4.00 (0.15)
5.00 (0.19)
5.00 (0.19)
D2
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
1.50 (0.06)
D3
0.70 (0.03)
1.00 (0.04)
2.00 (0.09)
2.00 (0.09)
D4
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
1.50 (0.06)
D5
0.75 (0.03)
1.25 (0.05)
1.60 (0.06)
2.50 (0.10)
Dimensions in millimeters (inches)
Component Spacing
For wave soldering components, must be spaced sufficiently
far apart to avoid bridging or shadowing (inability of solder
to penetrate properly into small spaces). This is less impor-
tant for reflow soldering but sufficient space must be
allowed to enable rework should it be required.
Preheat & Soldering
The rate of preheat should not exceed 4°C/second to
prevent thermal shock. A better maximum figure is about
2°C/second.
For capacitors size 1206 and below, with a maximum
thickness of 1.25mm, it is generally permissible to allow a
temperature differential from preheat to soldering of 150°C.
In all other cases this differential should not exceed 100°C.
For further specific application or process advice, please
consult AVX.
≥1.5mm
(0.06)
≥1mm
(0.04)
Cleaning
Care should be taken to ensure that the capacitors are
thoroughly cleaned of flux residues especially the space
beneath the capacitor. Such residues may otherwise
become conductive and effectively offer a low resistance
bypass to the capacitor.
Ultrasonic cleaning is permissible, the recommended
conditions being 8 Watts/litre at 20-45 kHz, with a process
cycle of 2 minutes vapor rinse, 2 minutes immersion in the
ultrasonic solvent bath and finally 2 minutes vapor rinse.
≥1mm
(0.04)
42
ETC [ ETC ]
