General Specifications
Mechanical
END TERMINATION ADHERENCE
Specification
No evidence of peeling of end terminal
Measuring Conditions
After soldering devices to circuit board apply 5N
(0.51kg f) for 10 ± 1 seconds, please refer to Figure 1.
5N FORCE
BEND STRENGTH
Speed = 1mm/sec
2mm
Deflection
R340mm
45mm
45mm
Supports
Figure 2. Bend Strength
Specification
DEVICE UNDER TEST
TEST BOARD
Figure 1.
Terminal Adhesion
RESISTANCE TO VIBRATION
Specification
Appearance:
No visual defects
Capacitance
Within specified tolerance
Q, Tan Delta
To meet initial requirement
Insulation Resistance
C0G (NP0), X7R Initial Value x 0.3
Z5U, Y5V Initial Value x 0.1
Measuring Conditions
Vibration Frequency
10-2000 Hz
Maximum Acceleration
20G
Swing Width
1.5mm
Test Time
X, Y, Z axis for 2 hours each, total 6 hours of test
Appearance:
No visual defects
Capacitance Variation
C0G (NP0): ± 5% or ± .5pF, whichever is larger
X7R:
≤
± 12%
Z5U:
≤
± 30%
Y5V:
≤
± 30%
Insulation Resistance
C0G (NP0):
≥
Initial Value x 0.3
X7R:
≥
Initial Value x 0.3
Z5U:
≥
Initial Value x 0.1
Y5V:
≥
Initial Value x 0.1
Measuring Conditions
Please refer to Figure 2
Deflection:
2mm
Test Time:
30 seconds
RESISTANCE TO SOLDER HEAT
Specification
Appearance:
No serious defects, <25% leaching of either end
terminal
Capacitance Variation
C0G (NP0): ± 2.5% or ± 2.5pF, whichever is greater
X7R:
≤
± 7.5%
Z5U:
≤
± 20%
Y5V:
≤
± 20%
Q, Tan Delta
To meet initial requirement
Insulation Resistance
To meet initial requirement
Dielectric Strength
No problem observed
Measuring Conditions
Dip device in eutectic solder at 260°C, for 1 minute.
Store at room temperature for 48 hours (24 hours for
C0G (NP0)) before measuring electrical parameters.
Part sizes larger than 3.20mm x 2.49mm are reheated
at 150°C for 30 ±5 seconds before performing test.
SOLDERABILITY
Specification
95% of each termination end should be covered with
fresh solder
Measuring Conditions
Dip device in eutectic solder at 230 ± 5°C for
2 ± .5 seconds
24
ETC [ ETC ]
