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TPA2001D2PWPR 参数 Datasheet PDF下载

TPA2001D2PWPR图片预览
型号: TPA2001D2PWPR
PDF下载: 下载PDF文件 查看货源
内容描述: 音频放大器|双| CMOS | TSSOP封装| 24PIN |塑料\n [AUDIO AMPLIFIER|DUAL|CMOS|TSSOP|24PIN|PLASTIC ]
分类和应用: 商用集成电路音频放大器光电二极管
文件页数/大小: 13 页 / 222 K
品牌: ETC [ ETC ]
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TPA2001D2
1-W FILTERLESS STEREO CLASS-D AUDIO POWER AMPLIFIER
SLOS292A – MARCH 2000 – REVISED APRIL 2000
MECHANICAL DATA
PWP (R-PDSO-G**)
20 PINS SHOWN
PowerPAD™ PLASTIC SMALL-OUTLINE
0,65
20
0,30
0,19
11
0,10
M
Thermal Pad
(See Note D)
4,50
4,30
6,60
6,20
0,15 NOM
Gage Plane
1
A
10
0°– 8°
0,25
0,75
0,50
Seating Plane
1,20 MAX
0,15
0,05
PINS **
DIM
A MAX
A MIN
0,10
14
5,10
4,90
16
5,10
4,90
20
6,60
6,40
24
7,90
7,70
28
9,80
9,60
4073225/F 10/98
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusions.
The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-153
PowerPAD is a trademark of Texas Instruments Incorporated.
12
POST OFFICE BOX 655303
DALLAS, TEXAS 75265