HT1625
Pad Assignment
8
7
8
6
8
5
8
4
8
3
8
2
8 0 7 8 7 7 7 6 7 5 7 4 7 3 7 2 7 1
7 9
1
8
1
6
7
6
6
6
5
R
D
7
0
6 8
9
6
S
E
G
4
2
2
W
R
6
6
4
3
S
S
E
E
G
G
4
4
1
0
3
D
A
T
A
V
S
S
4
6
2
S
S
E
E
G
G
3
3
9
8
6
1
5
O
S
C
I
6
0
S
S
E
E
G
G
3
3
7
6
6
O
S
C
O
5
9
V
D
D
D
7
V
L
C
8
9
5
5
8
7
S
S
E
E
G
G
3
3
5
4
I
R
Q
1
1
0
1
B
Z
5
5
6
5
S
S
E
E
G
G
3
3
3
2
B
Z
(
0
,
0
)
1
2
T
T
T
1
2
3
0
1
2
3
5
5
4
3
S
S
E
E
G
G
3
3
1
0
1
3
1
4
C
C
C
C
O
O
O
O
M
M
M
M
1
1
5
6
5
5
2
0
S
S
E
E
G
G
2
2
9
8
5
4
1
9
1
7
1
8
S
S
E
E
G
G
2
2
7
6
4
8
S
S
E
E
G
G
2
2
5
4
4
7
4
4
6
5
S
S
S
S
E
E
E
E
G
G
G
G
2
2
2
2
3
2
1
0
4
4
1
9
C
O
M
4
4
3
3
0
2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 2 3 3 3 4 3 5 3 6
7
4
2
3
8
3
9
4
0
4
1
2
Chip size: 192 ´ 211 (mil)2
* The IC substrate should be connected to VDD in the PCB layout artwork.
Rev. 1.10
3
September 11, 2002
ETC [ ETC ]
