• 300 mil, 26/24-Pin TSOP II
MILLIMETERS
DIM
INCHES
NOM.
---
RAD R1
RAD R
MIN.
---
NOM.
---
MAX.
1.20
0.15
1.05
0.52
0.45
0.21
0.16
17.27
MIN.
---
MAX.
0.047
0.006
0.041
0.020
0.018
0.008
(0.006)
0.680
26
21
19
14
A
A1
A2
b
A2
A1
c
0.05
0.95
0.30
0.30
0.12
0.12
17.01
---
0.002
0.037
0.012
0.012
0.005
0.005
0.670
---
B
1.00
---
0.039
---
B
E1
E
0.016
---
L
b1
c
0.40
---
DETAIL A
0 ~5
0.006
c1
D
0.15
17.14
0.95 REF.
b
0.675
SECTION B-B
b1
1
6
8
13
ZD
0.0374 BASIC
0.050 BASIC
e
1.27 BASIC
D
c
c1
E
9.02
7.49
0.40
0.12
0.12
9.22
7.62
0.50
---
9.42
7.75
0.60
0.25
---
0.355
0.295
0.016
0.005
0.005
0.363
0.300
0.020
---
0.371
E1
L
0.305
0.024
0.010
---
BASE METAL
R
WITH PLATING
R1
---
---
DETAIL A
(ZD)
NOTE:
1. CONTROLLING DIMENSION : MILLIMETERS
2. DIMENSION D DOES NOT INCLUDE MOLD PROTRUSION.
A
MOLD PROTRUSION SHALL NOT EXCEED 0.15(0.006") PER SIDE.
DIMENSION E1 DOES NOT INCLUDE INTERLEAD PROTRUSION.
INTERLEAD PROTRUSION SHALL NOT EXCEED 0.25(0.01") PER SIDE.
4-1.27
REF.
e
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSIONS/INTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD TO
BE WIDER THAN THE MAX b DIMENSION BY MORE THAN 0.13mm.
DAMBAR INTRUSION SHALL NOT CAUSE THE LEAD TO BE NARROWER
THAN THE MIN b DIMENSION BY MORE THAN 0.07mm.
SEATING PLANE
b
0.200(0.008")
M
0.100(0.004")
Rev.1
Page28
ETC [ ETC ]
