苏州华芯微电子股份有限公司
HuaXin Micro-electronics Co., Ltd
phone:0512-68711932
10. 封装外型图
10.1 DIP8 封装
Dimensions In Millimeters Dimensions In Inches
Symbol
Min
3.710
0.510
3.200
0.380
Max
Min
0.146
0.020
0.126
0.015
Max
A
A1
A2
B
4.310
0.170
3.600
0.570
0.142
0.022
B1
C
1.524(BSC)
0.060(BSC)
0.204
9.000
6.200
7.32
0.360
9.400
6.600
7.920
0.008
0.354
0.244
0.288
0.014
0.370
0.260
0.312
D
E
E1
e
2.540(BSC)
0.100(BSC)
L
3.000
8.400
3.600
9.000
0.118
0.331
0.142
0.354
E2
10.2 SOP8 封装
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
1.750
0.250
1.550
0.510
0.250
5.100
4.000
6.200
Min
Max
0.069
0.010
0.061
0.020
0.010
0.200
0.157
0.244
A
A1
A2
b
1.350
0.100
1.350
0.330
0.170
4.700
3.800
5.800
0.053
0.004
0.053
0.013
0.006
0.185
0.150
0.228
C
D
E
E1
E
1.270(BSC)
0.050(BSC)
L
0.400
1.270
0.016
0.050
θ
0°
8°
0°
8°
Information furnished is believed to be accurate and reliable. However, HuaXin Micro-electronics assumes no
responsibility for the consequences of use of such information nor for any infringement of patents or other rights of
third parties which may result from its use. The actual parts delivered may not completely agree with the description
written here and it is user’s responsibility to make wise judgment on the performance. HuaXin Micro-electronics
assumes no responsibility for the mismatch occurred. No license is granted by implication or otherwise under any patent
or patent rights of HuaXin Micro-electronics. Specifications mentioned in this publication are subject to change without
notice. This publication supersedes and replaces all information previously supplied. HuaXin Micro-electronics
products are not authorized for use as critical components in life support devices or systems without express written
approval of HuaXin Micro-electronics.
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