Product Specification
IXD3235/36/37
VOUT = 3.3 V, fOSC = 1.2 MHz, VIN = 3.7 V, IOUT = 100 mA
Ch 1 – VLX – 5 V/div; Ch 2 – VOUT – 2.0 mV/div
External components:
L = 4.7 µH (NP4018)
CIN = 4.7 µF (ceramic)
CL = 10 µF (ceramic)
14. The IC may enter unstable operation if the combination of ambient temperature, setting voltage, oscillation
frequency, and inductor’s value are not adequate. If IC operates close to the maximum duty cycle, it may
become
unstable, even if inductor values listed below
are used.
fOSC, MHz
3.0
VOUT, V
L, µH
VOUT = 3.3 V, fOSC = 1.2 MHz,
VIN = 4.0 V, IOUT = 150 mA
Ch 1 – VLX – 2.0 V/div;
0.8 V <VOUT < 4.0 V
VOUT ≤2.5 V
1.0 – 2.2
3.3 – 6.8
4.7 – 6.8
1.2
VOUT >2.5 V
Ch 2 – VOUT – 20 mV/div
External components:
L = 1.5 µH (NP3015)
CIN = 4.7 µF (ceramic)
CL = 10 µF (ceramic)
If an inductor less than 4.7μH is used at fOSC
=
1.2 MHz, or inductor less than 1.5 μH is used at fOSC
= 3.0 MHz, inductor peak current may easy reach
the current limit threshold ILIM. In this case, the IC
may be not able to provide 600mA output current.
15. The IC may become unstable, when it goes into continuous operation mode, and difference between VIN
and VOUT is high.
VOUT = 1.8 V, fOSC = 1.2 MHz,
VIN = 6.0 V, IOUT = 100 mA
Ch 1 – VOUT – 10 mV/div
Ch 2 – VLX – 5.0 V/div;
External components:
L = 4.7 µH (NP4018)
CIN = 4.7 µF (ceramic)
CL = 10 µF (ceramic)
16. Note on mounting (WLP-5-03)
a) Mounting pad design should be optimized for user's conditions.
b) Do not use eutectics solder paste. Sn-AG-Cu solder is used for the package terminals. If eutectic
solder is used, mounting reliability decreases.
c) When under fill agent is used to increase interfacial bonding strength, please take enough evaluation
for selection. Some under fill materials and application conditions may decrease bonding reliability.
d) The IC has exposed surface of silicon material in the top marking face and sides, so it is weak against
mechanical damages and external short circuit conditions. Please, take care of handling to avoid
cracks and breaks and keep the circuit open to avoid short-circuit from the outside.
e) Semi-transparent resin is coated on the circuit face of the package. Please be noted that the usage
under strong lights may affects device’s performance.
PS034201-0515
PRELIMINARY
15
ZILOG [ ZILOG, INC. ]
