Le87251
3.0
Absolute Maximum Ratings
Data Sheet
Stresses above the values listed under
Absolute Maximum Ratings
can cause permanent device failure.
Functionality at or above these limits is not implied. Exposure to absolute maximum ratings for extended periods
can affect device reliability.
Storage Temperature
Operating Ambient Temperature
Operating Junction Temperature
(See Notes 1 and 2)
VS+ to VS- Supply Voltage
VS+ with respect to GND
VS- with respect to GND
Driver inputs VINA/B/C/D
Control inputs ENAB/ENCD with respect to GND
Maximum current on any input
Maximum current at amplifier output (DC continuous)
ESD Immunity (Human Body Model)
ESD Immunity (Charge Device Model)
−65 ≤
T
A
≤
+150°C
−40 ≤
T
A
≤
+85°C
−40 ≤
T
A
≤
+150°C
−0.3
V to 30 V
−0.3
V to 30 V
−30
V to +0.3 V
VS- to VS+
−0.3
V to 6 V
10 mA
100 mA
JESD22 Class 2 compliant
JESD22 Class IV compliant
Note: Continuous operation above 145°C junction temperature may degrade device reliability.
3.1
Thermal Resistance
The thermal performance of a thermally enhanced package is assured through optimized printed circuit
board layout. Specified performance requires that the exposed thermal pad be soldered to an equally sized
exposed copper surface, which, in turn, conducts heat through multiple vias to larger internal copper
planes.Please refer to the
QFN Package
application note, available from http://www.zarlink.com, for layout and
heat sinking guidelines.
3.2
Package Assembly
The green package devices are assembled with enhanced, environmental compatible lead-free, halogen-free, and
antimony-free materials. The leads possess a matte-tin plating which is compatible with conventional board
assembly processes or newer lead-free board assembly processes.
Refer to IPC/JEDEC J-Std-020 Table 4-2 for recommended peak soldering temperature and Table 5-2 for the
recommended solder reflow temperature profile
.
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Zarlink Semiconductor Inc.
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
