Le79R241
Data Sheet
5.2 Thermal Resistance
The junction to air thermal resistance of the Le79R241 ISLIC device in a 32-pin PLCC package is 45° C/W and in a
32-pin QFN package is 25° C/W (measured under free air convection conditions and without external heat sinking).
5.2.1 Package Assembly
The standard (non-green) package devices are assembled with industry-standard mold compounds, and the leads
possess a tin/lead (Sn/Pb) plating. These packages are compatible with conventional SnPb eutectic solder board
assembly processes. The peak soldering temperature should not exceed 225°C during printed circuit board
assembly.
Green package devices are assembled with enhanced, environmental compatible lead-free, halogen-free, and
antimony-free materials. The leads possess a matte-tin plating which is compatible with conventional board
assembly processes or newer lead-free board assembly processes. The peak soldering temperature should not
exceed 245°C during printed circuit board assembly.
Refer to IPC/JEDEC J-Std-020B Table 5-2 for the recommended solder reflow temperature profile.
5.3 Operating Ranges
Zarlink guarantees the performance of this device over commercial (0ºC to 70ºC) and industrial (-40ºC to 85ºC)
temperature ranges by conducting electrical characterization over each range and by conducting a production test
with single insertion coupled to periodic sampling. These characterization and test procedures comply with section
4.6.2 of Bellcore GR-357-CORE Component Reliability Assurance Requirements for Telecommunications
Equipment.
5.3.1 Environmental Ranges
0 to 70° C Commercial
Ambient Temperature
–40 to +85 ° C extended temperature
Ambient Relative Humidity
15 to 85%
5.3.2 Electrical Ranges
VCC
5 V ± 5%
VBL
–15 V to VBH
–42.5 to –99V
–100 to +100 mV
20 k minimum
VBH
BGND with respect to GND
Load resistance on VTX to VREF
Load resistance on VSAB to VREF
20 k minimum
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Zarlink Semiconductor Inc.
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
