Le79228
Data Sheet
PHYSICAL DIMENSIONS
64-Pin Thin Quad Flat Pack (TQFP)
Notes:
Min
-
Nom
-
Max
1.20
0.15
1.05
Symbol
A
1. All dimensions and toleerances conform to ANSI Y14.5-1982.
2. Datum plane -H- is located at the mold parting line and is coincident
with the bottom of the lead where the lead exits the plastic body.
3. Dimensions “D1” and “E1” do not include mold protrusion. Allowable
protrusion is 0.254mm per side. Dimensions “D1” and “E1” include
A1
A2
D
0.05
0.95
-
1.00
12 BSC
10 BSC
12 BSC
10 BSC
0.60
D1
E
mold mismatch and are determined at Datum plane -H-
.
4. Dimension “B” does not include Dambar protrusion. Allowable Dambar
protrusion shall be 0.08mm total in excess of the “b” dimension at
maximum material condition. Dambar can not be located on the lower
radius or the foot.
E1
L
0.45
0.75
N
64
5. Controlling dimensions: Millimeter.
6. Dimensions “D” and “E” are measured from both innermost and
outermost points.
e
0.50 BSC
0.22
b
0.17
0.17
0.27
0.23
b1
ccc
ddd
aaa
0.20
7. Deviation from lead-tip true position shall be within 0.076mm for pitch
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8. Lead coplanarity shall be within: (Refer to 06-500)
1- 0.10mm for devices with lead pitch of 0.65-0.80mm.
2- 0.076mm for devices with lead pitch of 0.50mm.
Coplanarity is measured per specification 06-500.
9. Half span (center of package to lead tip) shall be
15.30 0.165mm ꢀ.602” .0065”ꢁ.
0.08
0.08
0.20
JEDEC #: MS-026 (C) ACD
10. “N” is the total number of terminals.
11. The top of package is smaller than the bottom of the package by 0.15mm.
12. This outline conforms to Jedec publication 95 registration MS-026
13. The 160 lead is a compliant depopulation of the 176 lead MS-026
variation BGA.
64-Pin TQFP
Note:
Packages may have mold tooling markings on the surface. These markings have no impact on the form, fit or function of the
device. Markings will vary with the mold tool used in manufacturing.
35
Zarlink Semiconductor Inc.
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
