Le79489
ABSOLUTE MAXIMUM RATINGS
Storage temperature. . . . . . . . . . . . . . . . . –55°C to +150°C
With respect to AGND/DGND:
V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.4 V to +7.0 V
V
BAT1
Continuous. . . . . . . . . . . . . . . . . . . . . . +0.4 V to –70 V
10 ms . . . . . . . . . . . . . . . . . . . . . . . . . . +0.4 V to –75 V
V
BAT2
and BSWTH. . . . . . . . . . . . . . . . . . +0.4 V to V
BAT1
BGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3 V to –3 V
A(TIP) or B(RING) with respect to BGND:
Continuous. . . . . . . . . . . . . . . . . . . . . . . .V
BAT1
to +1 V
10 ms (f = 0.1 Hz) . . . . . . . . . . . . . . . . . . –70 V to +5 V
1 µs (f = 0.1 Hz) . . . . . . . . . . . . . . . . . . . –80 V to +8 V
250 ns (f = 0.1 Hz). . . . . . . . . . . . . . . . . –90 V to +12 V
Current from A(TIP) or B(RING) . . . . . . . . . . . . . ±150 mA
TESTOUT/RINGOUT/current . . . . . . . . . . . . . . . . . 80 mA
TESTOUT/RINGOUT/voltage . . . . . . . . . . BGND to +7 V
TESTOUT/RINGOUT/transient . . . . . . . . BGND to +10 V
DA and DB inputs
Voltage on ring-trip inputs. . . . . . . . . . . . . V
BAT1
to 0 V
Current on ring-trip inputs. . . . . . . . . . . . . . . . . ±10 mA
C4–C1, BSWEN, OVH, E1
Input voltage . . . . . . . . . . . . . . . –0.4 V to V
CC
+ 0.4 V
Maximum power dissipation, continuous*
T
A
= 70°C, No heat sink (see note):
In 32-pin PLCC package . . . . . . . . . . . . . . . . . . . .1.7 W
Thermal data (θ
JA
)
In 32-pin PLCC package ..............................43°C/W typ
ESD immunity (HBM) . . . . . . JESD22 Class 1C compliant
* Thermal limiting circuitry on chip will shut down the circuit at a
junction temperature of about 165°C. Continuous operation above
145°C junction temperature may degrade device reliability.
Stresses above those listed under Absolute Maximum Ratings may
cause permanent device failure. Functionality at or above these lim-
its is not implied. Exposure to Absolute Maximum Ratings for ex-
tended periods may affect device reliability.
Data Sheet
OPERATING RANGES
Commercial (C) Devices
Ambient temperature . . . . . . . . . . . . . . . . –40°C to +85°C*
V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.75 V to 5.25 V
BAT1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40.5 V to –60 V
BAT2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 V to BAT1
AGND/DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V
BGND with respect to GND . . . . . . .–100 mV to +100 mV
Load resistance on VTX to GND . . . . . . . . . . . .20 kΩ min
Operating ranges define those limits over which the functionality of
the device is guaranteed by production testing.
*Zarlink guarantees the performance of this device over
commercial (0 to 70°C) and industrial (-40 to 85
°C)
temperature
ranges by conducting electrical characterization over each range
and by conducting a production test with single insertion coupled
to periodic sampling. These characterization and test procedures
comply with section 4.6.2 of Bellcore TR-TSY-000357 Component
Reliability Assurance Requirements for Telecommunications
Equipment.
Package Assembly
Green package devices are assembled with enhanced,
environmental compatible lead-free, halogen-free, and
antimony-free materials. The leads possess a matte-tin
plating which is compatible with conventional board assembly
processes or newer lead-free board assembly processes.
The peak soldering temperature should not exceed 245°C
during printed circuit board
5
Zarlink Semiconductor Inc.
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
