ABSOLUTE MAXIMUM RATINGS
Storage temperature . . . . . . . . . . . . –55°C to +150°C
V
CC
with respect to AGND/DGND . . .–0.4 V to +7.0 V
V
BAT
with respect to AGND/DGND:
Continuous . . . . . . . . . . . . . . . . . +0.4 V to –70 V
10 ms. . . . . . . . . . . . . . . . . . . . . . +0.4 V to –75 V
BGND with respect to AGND/DGND . . . .+3 V to –3 V
A(TIP) or B(RING) to BGND:
Continuous . . . . . . . . . . . . . . . . . . . .V
BAT
to +1 V
10 ms (f = 0.1 Hz) . . . . . . . . . . . . . . –70 V to +5 V
1
µs
(f = 0.1 Hz). . . . . . . . . . . . . . . . –80 V to +8 V
250 ns (f = 0.1 Hz) . . . . . . . . . . . . .–90 V to +12 V
Current from A(TIP) or B(RING). . . . . . . . . .
±150
mA
RINGOUT and RYOUT1 outputs:
RINGOUT current . . . . . . . . . . . . . . . . . . . 75 mA
RYOUT1 current . . . . . . . . . . . . . . . . . . . 120 mA
Voltage. . . . . . . . . . . . . . . . . . . . . . BGND to +7 V
Transient . . . . . . . . . . . . . . . . . . . BGND to +10 V
DA and DB inputs:
Voltage on ring-trip inputs . . . . . . . . . .V
BAT
to 0 V
Current into ring-trip inputs . . . . . . . . . . .
±10
mA
C3–C1, D1, and CS:
Input voltage . . . . . . . . . . –0.4 V to (V
CC
+ 0.4 V)
Maximum power dissipation, continuous,*
T
A
= 70°C, No heat sink (See note):
In 28-pin SOIC package . . . . . . . . . . . . . . 1.35 W
Thermal Data:
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .θ
JA
In 28-pin SOIC package . . . . . . . . . . .60°C/W typ
ESD immunity/pin (HBM) . . . . . . . . . . . . . . . . . 1500 V
*Note:
Thermal limiting circuitry on chip will shut down the
circuit at a junction temperature of about 165°C. The device
should never be exposed to this temperature. Operation
above 145°C junction temperature may degrade device
reliability. See the SLIC Packaging Considerations for more
information.
Stresses above those listed under Absolute Maximum Ratings
can cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to Absolute Maximum
Ratings for extended periods may affect device reliability.
OPERATING RANGES
Commercial (C) Devices
Ambient temperature . . . . . . . . . . . . . . 0°C to +70°C*
V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . 4.75 V to 5.25 V
V
BAT
. . . . . . . . . . . . . . . . . . . . . . . . . . –20 V to –58 V
AGND/DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V
BGND with respect to
AGND/DGND . . . . . . . . . . . –100 mV to +100 mV
Load resistance on VTX to ground . . . . . . . 20 kΩ min
Operating Ranges define those limits between which device
functionality is guaranteed.
* Legerity guarantees the performance of this device over
commercial (0 to 70°C) and industrial (-40 to 85
°C)
temperature ranges by conducting electrical characterization
over each range and by conducting a production test with
single insertion coupled to periodic sampling. These
characterization and test procedures comply with section
4.6.2 of Bellcore TR-TSY-000357 Component Reliability
Assurance Requirements for Telecommunications
Equipment.
Le7925 Data Sheet
5
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
