Le7920
ABSOLUTE MAXIMUM RATINGS
Storage temperature ......................... –55°C to +150°C
V
CC
with respect to AGND/DGND ..... –0.4 V to +7.0 V
V
BAT
with respect to AGND/DGND:
Continuous..................................... +0.4 V to –70 V
10 ms ............................................. +0.4 V to –75 V
BGND with respect to AGND/DGND........ +3 V to –3 V
A(TIP) or B(RING) to BGND:
Continuous ........................................ V
BAT
to +1 V
10 ms (f = 0.1 Hz) ............................. –70 V to +5 V
1 µs (f = 0.1 Hz) ................................ –80 V to +8 V
250 ns (f = 0.1 Hz) .......................... –90 V to +12 V
Current from A(TIP) or B(RING).....................±150 mA
RINGOUT/RYOUT1,2,3 current.........................50 mA
RINGOUT/RYOUT1,2,3 voltage ........... BGND to +7 V
RINGOUT/RYOUT1,2,3 transient ....... BGND to +10 V
DA and DB inputs
Voltage on ring-trip inputs .....................V
BAT
to 0 V
Current into ring-trip inputs ......................... ±10 mA
C2–C1 and D3–D1
Input voltage .........................–0.4 V to V
CC
+ 0.4 V
Maximum power dissipation, continuous,
T
A
= 70°C, No heat sink (See note)
In 32-pin PLCC package................................1.7 W
Thermal Data:................................................................θ
JA
In 32-pin PLCC package....................... 43°C/W typ
ESD immunity/pin (HBM) ..................................1500 V
Data Sheet
Note:
Thermal limiting circuitry on chip will shut down the circuit at a junction temperature of about 165°C. Continuous operation
above 145°C junction temperature may degrade device reliability.
Stresses above those listed under "Absolute Maximum Ratings" can cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.
6
Zarlink Semiconductor Inc.
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
