Le75183
Data Sheet
PHYSICAL DIMENSIONS
28-Pin, Plastic SOIC (GULL) (Le75183AESC/BESC/CESC/CZESC/DESC)
Small Outline Package (28 SOIC)
Millimeter
Nom
2.54
Inch
Nom
0.100
0.006
0.016
0.010
0.295
0.050 BSC
0.406
0.020
0.028
-
Symbol
Min
2.35
0.10
0.33
0.23
7.40
Max
2.65
0.30
0.51
0.32
7.60
Min
Max
0.104
0.012
0.020
0.012
0.299
A
A1
B
C
E
e
H
h
0.092
0.004
0.013
0.009
0.291
0.17
0.42
0.25
7.50
1.27 BSC
10.30
0.50
10.00
0.25
0.40
0 deg
0.00
17.70
10.65
0.75
1.27
8 deg
0.01
18.10
0.394
0.009
0.015
0 deg
0.000
0.697
0.419
0.029
0.050
8 deg
0.004
0.712
L
0.70
-
Y
D
-
17.90
0.705
NOTE:
Option: Square dotted line is E-Pad outline
Size dependent on die attach pad
28-Pin SOIC
Note:
Packages may have mold tooling markings on the surface. These markings have no impact on the form, fit or function of the
device. Markings will vary with the mold tool used in manufacturing.
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Zarlink Semiconductor Inc.
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