Le75183
PHYSICAL DIMENSIONS
28-Pin, Plastic SOIC (GULL) (Le75183AESC/BESC/CESC/CZESC/DESC)
Data Sheet
Symbol
A
A1
B
C
E
e
H
h
L
Y
D
Small Outline Package (28 SOIC)
Millimeter
Inch
Min
Nom
Max
Min
Nom
2.35
2.54
2.65
0.092
0.100
0.10
0.17
0.30
0.004
0.006
0.33
0.42
0.51
0.013
0.016
0.23
0.25
0.32
0.009
0.010
7.40
7.50
7.60
0.291
0.295
1.27 BSC
0.050 BSC
10.00
10.30
10.65
0.394
0.406
0.25
0.50
0.75
0.009
0.020
0.40
0.70
1.27
0.015
0.028
0 deg
-
8 deg
0 deg
-
0.00
0.01
0.000
-
17.70
17.90
18.10
0.697
0.705
Max
0.104
0.012
0.020
0.012
0.299
0.419
0.029
0.050
8 deg
0.004
0.712
NOTE:
Option: Square dotted line is E-Pad outline
Size dependent on die attach pad
28-Pin SOIC
Note:
Packages may have mold tooling markings on the surface. These markings have no impact on the form, fit or function of the
device. Markings will vary with the mold tool used in manufacturing.
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Zarlink Semiconductor Inc.
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
