Le75183
4.0
Absolute Maximum Ratings
Data Sheet
Stresses above those listed under
Absolute Maximum Ratings
can cause permanent device failure. Functionality at
or above these limits is not implied. Exposure to absolute maximum ratings for extended periods may affect device
reliability.
Parameter
Operating Temperature Range
Storage Temperature Range
Relative Humidity Range
Pin Soldering Temperature (t=10s max)
5 V Power Supply
Battery Supply
Logic Input Voltage
Input-to-output Isolation
Pole-to-pole Isolation (All except SW6, SW8)
Pole-to-pole Isolation (Ringing Access Switch, SW8)
Pole-to-pole Isolation (Ringing Test Switch, SW6)
ESD Immunity (Human Body Model)
Note:
For LCAS in the QFN package, it is desirable that the exposed pad be soldered to an equally sized exposed copper surface (with no
further electrical connection such as VBAT or ground) for mechanical stability.
Min.
–40
–40
5
—
-0.3
—
-0.3
—
—
—
—
Max.
110
150
95
260
7
–85
VDD+0.3
330
330
480
260
Unit
°C
°C
%
°C
V
V
V
V
V
V
V
JESD22 Class 1C compliant
8
Zarlink Semiconductor Inc.
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
