54HSC/T630
PIN ASSIGNMENTS
Figure 7: 28-Lead Ceramic DIL (Solder Seal)
- Package Style C
Figure 8: 28-Lead Flatpack (Solder Seal) - Package Style F
PACKAGE OUTLINES
Ref
A
A1
D
b
c
D
14
1
e
e1
H
Me
Z
15
28
W
Millimetres
Min.
-
0.38
0.35
0.20
-
-
-
4.71
-
-
-
Nom.
-
-
-
-
-
2.54 Typ.
15.24 Typ.
-
-
-
-
Max.
5.715
1.53
0.59
0.36
36.02
-
-
5.38
15.90
1.27
1.53
Min.
-
0.015
0.014
0.008
-
-
-
0.185
-
-
-
Inches
Nom.
-
-
-
-
-
0.100 Typ.
0.600 Typ.
-
-
-
-
Max.
0.225
0.060
0.023
0.014
1.418
-
-
0.212
0.626
0.050
0.060
XG404
W
Seating Plane
M
E
A
1
A
H
e
b
Z
15°
C
e
1
Figure 9: 28-Lead Ceramic DIL (Solder Seal) - Package Style C
7
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