YB1900
Ultra Low Quiescent Current Smart Load Switch
Constraints for the YB1900 are maximum
junction temperature T
J(MAX)
= 125℃, and
package thermal resistance,
θ
JA
= 220℃/W.
The maximum continuous output current for
YB1900 depends on package power
dissipation and the R
DS(ON)
of MOSFET at
T
J(MAX).
Typical conditions are calculated
under normal ambient condition where T
A
=
25℃ At 85℃, P
D(MAX)
= 181mW. At T
A
= 25℃,
P
D(MAX)
= 454mW.
The maximum current is calculated by the
following equation:
I
OUT
< (P
D(MAX)
/ R
DS(MAX)
)^(1/2)
For example, if V
IN
= 5V, R
DS(MAX)
= 100mΩ
and T
A
= 25℃, I
OUT(MAX)
= 2.2A.
Thermal Shutdown is employed to protect
the device damage when over temperature
160℃.
PCB Layout Consideration
To maximize YB1900 performance, some
board layout rules should be followed:
V
IN
and V
OUT
should be routed using wider
than normal traces, and GND should be
connected to a ground plane. For best
performance, C
IN
and C
OUT
should be
placed close to the package pins.
YB1900 MRev.1.2
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YOBON [ YOBON TECHNOLOGIES,INC. ]
