Product specification
15
18
General Purpose & High Cap.
X5R
4 V to 50 V
Surface Mount Multilayer Ceramic Capacitors
TEST
TEST METHOD PROCEDURE
REQUIREMENTS
IEC 60384- 4.8
21/22
Mounting in accordance with IEC 60384-22 paragraph 4.3
No visible damage
Bond
Strength of
Plating on
End Face
<General purpose series>
∆C/C
Conditions: bending 1 mm at a rate of 1 mm/s, radius jig
340 mm
Class2:
X5R: ±10%
<High Capacitance series>
∆C/C
Class2:
X5R: ±10%
4.9
Precondition: 150 +0/–10 °C for 1 hour, then keep for 24 Dissolution of the end face plating shall
Resistance to
Soldering
Heat
±1 hours at room temperature
not exceed 25% of the length of the
edge concerned
Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute
Preheating: for size >1206: 100 °C to 120 °C for 1 minute
and 170 °C to 200 °C for 1 minute
<General purpose series>
∆C/C
Class2:
X5R: ±10%
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
<High Capacitance series>
∆C/C
Class2:
X5R: ±10%
D.F. within initial specified value
R
ins within initial specified value
4.10
Preheated the temperature of 80 °C to 140 °C and
maintained for 30 seconds to 60 seconds.
The solder should cover over 95% of
the critical area of each termination
Solderability
Test conditions for lead-free containing solder alloy
Temperature: 235 ±5 °C
Dipping time: 2 ±0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for lead-free containing solder alloy
Temperature: 245 ±5 °C
Dipping time: 3 ±0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
www.yageo.com
Feb 10, 2012 V.12
YAGEO [ YAGEO CORPORATION ]
